Failure Analysis Engineering Intern (Summer 2027)

Location: Malta, New York, United States; onsite at a 300mm fabrication facility. Full-time internship requiring at least 40 hours per week. Up to 10% travel.

Expected salary: $20.00–$40.00 per hour. An additional listed range is $0.00–$0.00; exact salary depends on qualifications, experience, and location.

Company

hirify.global manufactures essential semiconductors for high-growth markets, including solutions enabling AI at scale.

What you will do

• Support advanced failure analyses while meeting turnaround-time requirements and maintaining quality.
• Collaborate with laboratory shift teams, engineers, and managers to define analytical methods, align expectations, and interpret results.
• Work with Process Integration, Process Module, Product Engineering, and Customer Engineering organizations to meet technology requirements and deadlines.
• Identify opportunities to improve workflow optimization, cycle time, equipment utilization, and cost.
• Participate in continuous-improvement activities and laboratory process enhancements.
• Follow Environmental, Health, Safety & Security requirements and communicate effectively with peers and cross-functional teams.

Requirements

• Be at least a sophomore at the time of application and actively pursue a Bachelor’s or Master’s degree during the internship in Physics, Materials Science, Optical Engineering, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related field through an accredited degree program.
• Maintain an overall GPA of at least 3.0 and good academic standing.
• English fluency is required for written and verbal communication.
• Be able to work at least 40 hours per week during the internship.

Nice to have

• Prior related internship or co-op experience.
• Leadership experience in the workplace, school projects, competitions, or similar settings.
• Strong interest in using AI tools and emerging technologies to improve productivity, streamline workflows, and support decision-making.
• Project management skills, including innovating and executing solutions and navigating ambiguity.
• Strong written and verbal communication, planning, organizational, analytical, and structured-work skills.
• Relevant coursework, research, or laboratory experience in failure analysis, wafer processing, or semiconductor materials and device characterization.
• Hands-on experience with sample preparation, cross-sectioning, microscopy, or analytical characterization techniques.
• Familiarity with OBIRCH, emission microscopy, thermal microscopy, SEM, FIB, X-ray analysis, C-SAM, AFM, SIMS, or TEM imaging.
• Ability to understand complex technical matters quickly and proficiency in MS Office Suite.

Culture & Benefits

• One-on-one mentorship and work assignments focused on professional growth.
• Professional development opportunities and networking with executives.
• Collaboration across laboratory, engineering, and customer-facing organizations.
• Work in a safety-focused semiconductor manufacturing environment.