Engineer - Frame Engineering (Semiconductor)

Location: Malta, New York, USA; the role also references Burlington, Vermont, USA. Onsite role.

Expected salary: $69,000–$120,000 per year.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Facilitate technology frame requirements, design frame structures and layouts, generate chip frames, execute changes, prioritize work queues, and coordinate hand-offs across geographic locations.
• Use and customize internal and commercial software tools, including generating input files that drive automation for fabs and mask houses.
• Make decisions to hold, escalate, promote, or reject tape-out support issues in coordination with fabrication, tape-out logistics integration, and field application engineering teams.
• Collaborate with Application Engineering, Product Engineering, Release, Design Enablement, fabrication, and technology development teams to improve customer tape-out operations.
• Assess processes, identify automation opportunities, reduce costs and cycle time, and improve productivity.
• Document processes and ensure failure modes have appropriate mitigation and detection controls while supporting environmental, health, safety, and security requirements.

Requirements

• Bachelor’s degree in EE, ECE, CSE, Physics, or Mechanical Engineering.
• At least 2 years of relevant experience.
• Working knowledge of Unix shells and the interest and aptitude to learn domain-specific programming, scripting languages, and data formats.
• Ability to communicate and work with cross-geographic, multicultural global teams.
• Fluency in written and verbal English.
• Analytical problem-solving and decision-making skills.
• US citizenship is required.
• Must be eligible to obtain and maintain a SECRET-level US Government security clearance.

Nice to have

• Experience with Cadence Mask Compose.
• Experience with the Virtuoso environment, SKILL programming, and device layout.
• Project management skills, including innovating and executing solutions and navigating ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Culture & Benefits

• Work within a global semiconductor manufacturing organization and collaborate across geographic locations.
• Participate in an Industry 4.0 digitalization journey using artificial intelligence, machine learning, robotics, and big data analytics.
• Support continuous improvement, advanced manufacturing, process quality, and operational efficiency.
• Employment is subject to applicable pre-employment conditions and may require a US Department of Defense security clearance.
• Reasonable accommodation is available during the employment process.