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3 дня назад

Intel Foundry Module Development Engineer (Advanced Wet Etch and Cleans)

133 800 - 188 890$
Формат работы
hybrid
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Intel Foundry Module Development Engineer (Advanced Wet Etch and Cleans) (Semiconductor Manufacturing/AI): Developing advanced wet etch, selective removal, chemical clean, and drying processes for 300mm semiconductor manufacturing with an accent on chemical kinetics, surface science, hardware co-optimization, and process scale-up. Focus on designing experiments, modeling fluid and chemical behavior with scientific computing, reducing defects, and transferring laboratory innovations to high-volume fabs.

Location: Hillsboro, Oregon, United States. The role follows a hybrid work model, combining on-site work at an assigned hirify.global site with off-site work.

Annual salary: $133,800–$188,890 USD.

Company

hirify.global Foundry Technology and Development develops advanced semiconductor manufacturing technologies and scales them across high-volume global fabs.

What you will do

  • Develop and validate wet etch, selective removal, advanced cleaning, and drying processes for RibbonFET/GAA transistors, PowerVia backside power delivery, and high-density interconnects.
  • Design and execute rigorous design-of-experiments programs to characterize chemical and surface processes.
  • Co-optimize wet-processing hardware with semiconductor equipment suppliers and specialty chemical vendors, including dispense, megasonic, chamber, and single-wafer systems.
  • Apply computational fluid dynamics, chemical kinetics modeling, statistical physics, data science, and machine learning to improve formulation screening, defectivity, and line yield.
  • Translate chemical, electrochemical, and surface phenomena into patents, trade secrets, and proprietary process solutions.
  • Scale laboratory and coupon-level results to 300mm fab production using hirify.global’s Copy Exactly methodology.

Requirements

  • Ph.D. completed or expected within 12 months in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering, Physics, or a closely related discipline.
  • At least 2 years of hands-on experimental research experience in areas such as wet chemical synthesis or etching, solution chemistry, electrochemistry, surface functionalization, thin-film interfaces, or cleanroom wet-bench processing.
  • Experience with chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion or passivation, or advanced cleaning and drying mechanisms.
  • Experience with thin-film, surface, and chemical characterization methods such as ellipsometry, AFM, SEM/TEM, XPS, contact-angle measurement, FTIR, TXRF, or ICP-MS.
  • Experience with automated fluidic systems, wet-processing instrumentation, single-wafer spin hardware, or fluid-dynamics and mass-transfer troubleshooting.
  • Ability to use Python, MATLAB, JMP, or machine learning for design of experiments, statistical analysis, or process automation.

Nice to have

  • Strong publication record, conference presentations, or filed patent applications in experimental chemical or materials science.

Culture & Benefits

  • Access to advanced 300mm cleanroom facilities, single-wafer wet-processing platforms, and surface-characterization equipment.
  • Collaboration with hirify.global Fellows, Senior Principal Engineers, semiconductor equipment suppliers, and specialty chemical vendors.
  • Technical mentorship and an accelerated path toward technical distinction.
  • Competitive Ph.D. compensation package with sign-on and annual performance bonuses, ESPP, and equity or RSU grants.
  • Health, retirement, vacation, and full relocation assistance benefits.

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