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7 дней назад

Principal Engineer (PVD Equipment & Process Development)

205 800 - 360 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Engineer (PVD Equipment & Process Development) (Semiconductor Manufacturing/PVD): Developing next-generation PVD equipment, chambers, hardware, and process capabilities for advanced semiconductor devices with an accent on thin-film deposition, metallization, annealing, and device integration. Focus on translating future device and material requirements into equipment roadmaps, leading cross-functional technical programs, and driving development from technology evaluation through qualification and manufacturing implementation.

Location: Milpitas, California, United States; onsite role with approximately 20% domestic and international travel.

Salary: $205,800–$360,200 annually.

Company

hirify.global provides semiconductor inspection tools, metrology systems, process solutions, and computational analytics, including advanced wafer-processing solutions for etch, deposition, and vapor-based technologies.

What you will do

  • Lead technical projects developing new PVD equipment, chambers, hardware, and process capabilities for future semiconductor devices.
  • Define requirements, technical breakthroughs, priorities, schedules, and risks across sophisticated development programs.
  • Partner with process and hardware engineering teams to optimize PVD chamber and equipment capabilities.
  • Translate device, metallization, and material requirements into equipment, chamber, hardware, and process requirements.
  • Coordinate development across process engineering, hardware, materials, device integration, characterization, manufacturing, and supplier teams.
  • Lead activities from early technology evaluation through equipment and process qualification, implementation, and communication of technical recommendations to leadership and partners.

Requirements

  • M.S. or Ph.D. in Chemical Engineering, Electrical Engineering, Physics, Materials Science, or a related semiconductor discipline.
  • 15+ years of semiconductor experience in PVD, thin-film deposition, metallization, process equipment, or related technology development.
  • Deep technical knowledge of PVD deposition processes and equipment.
  • Experience developing, modifying, or introducing PVD equipment, process chambers, or chamber hardware.
  • Strong understanding of semiconductor device integration and fabrication, including processes before and after metallization.
  • Experience with device metallization and annealing and their relationship to device performance.
  • Experience leading complex technical development projects involving process, equipment, hardware, materials, and device requirements.
  • Experience evaluating or introducing new deposition materials and material stacks for advanced device applications.
  • Knowledge of materials and device characterization and ability to use characterization results to guide technical development.
  • Experience collaborating with semiconductor equipment manufacturers and component suppliers, plus strong technical leadership, project management, communication, and multifunctional collaboration skills.

Nice to have

  • Experience developing or modifying PVD chambers, sources, or other deposition-system hardware.
  • Experience taking new equipment and process capabilities from concept through development, qualification, and manufacturing implementation.
  • Knowledge of CVD and other thin-film deposition technologies.
  • Experience working with global equipment and component suppliers.

Culture & Benefits

  • Medical, dental, vision, life, and other voluntary benefits.
  • 401(k) with company matching and an employee stock purchase program.
  • Student debt assistance, tuition reimbursement, development programs, and career growth opportunities.
  • Financial planning, wellness, employee assistance, paid time off, paid holidays, and family care and bonding leave.
  • Work on semiconductor technologies supporting AI, data centers, automotive, and electronic devices.

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