Engineer Packaging Test Engineering (Semiconductors)

Location: SGP - Woodlands, Singapore

Company

hirify.global manufactures essential semiconductors for high-growth markets, with manufacturing operations across the U.S., Europe, and Asia.

What you will do

• Support the development, validation, release, and documentation of electrical test methods for wafers, dies, interposers, package-level structures, and advanced packaging test vehicles.
• Conduct electrical characterization, engineering experiments, data collection, qualification activities, reliability readouts, and manufacturing-readiness work.
• Support the definition, qualification, troubleshooting, and correlation of probe cards, sockets, load boards, interface hardware, cables, and related test fixtures.
• Analyze test data to identify trends, outliers, failure signatures, yield-loss mechanisms, and potential root causes; summarize findings for technical reviews.
• Contribute to test coverage reviews, guardband evaluation, repeatability and reproducibility studies, cycle-time reduction, automation, data-quality improvement, and test-method standardization.
• Collaborate with integration, design, process, product, reliability, equipment, manufacturing, supplier, and global engineering teams while following safety, cleanroom, laboratory, quality, document-control, and information-security requirements.

Requirements

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Microelectronics, Applied Physics, Materials Science, Mechanical Engineering, or a related technical field.
• Basic understanding of semiconductor devices, electrical measurements, circuits, and data interpretation.
• Working knowledge of laboratory instruments such as digital multimeters, oscilloscopes, source-measure units, power supplies, or parameter analyzers.
• Ability to analyze structured datasets using Excel or a technical analysis environment such as Python, JMP, or MATLAB.
• Strong problem-solving skills, attention to detail, willingness to learn unfamiliar technologies and tools, and strong written and verbal communication skills.
• Ability to work effectively in cross-functional teams.

Nice to have

• Prior related internship or co-op experience.
• Prior leadership experience in the workplace, school projects, competitions, or similar settings.
• Project management skills, including the ability to innovate, execute solutions, and navigate ambiguity.
• Strong interest in using AI tools and emerging technologies to improve productivity, streamline workflows, and support decision-making.
• Exposure to automated test equipment, wafer probing, package final test, bench characterization, or test-program development.
• Understanding of statistics, design of experiments, measurement-system analysis, statistical process control, or semiconductor yield concepts.
• Awareness of advanced packaging technologies including 2.5D/3D integration, TSVs, interposers, micro-bumps, hybrid bonding, high-bandwidth memory, or system-in-package.
• Exposure to signal integrity, power integrity, thermal effects, mechanical stress, or reliability considerations in package and test design.

Culture & Benefits

• Full-time employment with learning, mentorship, networking, and professional-development opportunities.
• Cross-functional collaboration with local and global engineering teams, suppliers, and manufacturing partners.
• Comprehensive training and development are provided; candidates without prior work experience may apply.
• Inclusive and multicultural workplace focused on respect, diversity, security, longevity, and sustainability.
• Employment offers are subject to applicable background checks, medical screenings, and local laws.