Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Чёткие обязанности, известная компания в сфере полупроводникового оборудования и работа со сложными системами делают вакансию сильной нишевой возможностью. Зарплата не указана, поэтому её соответствие рыночному ориентиру остаётся неизвестным.
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Зарплата не указанаПонятные задачиСильная отрасльПоддержка переезда
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Global Product Support Engineer (Automation) (Semiconductor Automation): Supporting new product design, introduction, field readiness, and serviceability for vacuum mainframe and substrate-handling systems with an accent on robotics, qualification, documentation, and reliability. Focus on building and testing new systems, resolving lab and field escalations, conducting failure analysis and CAPA/8D activities, and preparing training and maintenance procedures.
Location: Singapore, SGP; Science Park II, moving to Tampines at the end of 2026. On-site support is required for critical escalations, with occasional customer-site travel.
Company
hirify.global develops materials science, engineering, and semiconductor manufacturing solutions used in advanced chips and displays.
What you will do
Support new product design, introduction, first builds, testing, beta-site plans, and field readiness for vacuum mainframe platform products.
Develop installation plans, technical product manuals, maintenance procedures, troubleshooting guides, lessons learned, BKMs, customer notices, and service bulletins.
Own resolution of laboratory nonconformances, field issues, escalations, corrective actions, and documentation change requirements.
Collaborate with supplier manufacturing, business units, quality and reliability, documentation, engineering, field, and customer teams.
Lead or support failure analysis, FMECA, CAPA/8D, qualification data collection, and integration of corrective actions into new designs.
Prepare product training, train field and technical personnel, and coordinate initial spare-parts readiness.
Requirements
Bachelor’s degree in engineering or a related field.
2–4 years of experience with hardware, semiconductor capital equipment, robotics/EFEM, or complex electromechanical systems.
Experience with vacuum mainframes, automation, robots, substrate handling, SCARA or Cartesian arms, prealigners, and end-effectors.
Knowledge of software and firmware control systems, system installation and startup, retrofit and maintenance documentation, and schematic or print reading.
Experience with FMECA, failure analysis, CAPA or 8D, qualification data analysis, and best-known methods.
Strong cross-functional communication, technical judgment, problem-solving, and ability to explain complex topics clearly.
Nice to have
Service or field procedure writing experience.
Experience with beta-site test plans and customer-facing escalations.
Prior training or train-the-trainer experience.
Culture & Benefits
Supportive environment focused on learning, professional development, and career growth.
Health and wellbeing programs and employee support.
Full-time regular employment with approximately 10% travel.
Relocation eligibility is provided.
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