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6 дней назад

Principal Hardware Design Engineer (High-Speed PCB)

150 680 - 225 700$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Hardware Design Engineer (High-Speed PCB): Designing and bringing up complex high-speed boards and networking platforms integrating silicon, packaging, and optics with an accent on PCB layout, signal integrity, power integrity, and system-level architecture. Focus on leading board development teams, debugging advanced hardware in the lab, and resolving design risks across high-density platform systems.

Location: Santa Clara, California, United States

Expected base pay: $150,680–$225,700 per annum

Company

hirify.global develops semiconductor solutions and data infrastructure technologies for enterprise, cloud, AI, carrier, communications, and critical infrastructure markets.

What you will do

  • Lead the design and development of complex high-speed boards and networking platforms spanning boards, switches, and optics.
  • Own schematic capture, PCB layout, board builds, bring-up, testing, and delivery against technical and business requirements.
  • Drive system-level decisions involving power, thermal performance, signal integrity, and reliability.
  • Lead hardware engineers and technicians through planning, design, manufacturing, testing, and delivery.
  • Collaborate with design, packaging, software, marketing, validation, PCB vendors, ODMs, and contract manufacturers.
  • Perform hands-on laboratory bring-up and debugging, review customer designs, and lead root-cause and corrective-action activities.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Science, or a related field with 10–15 years of relevant experience, or an advanced degree with 5–10 years of experience.
  • Direct experience designing high-speed, high-density PCBs with DDR3/4/5, PCIe Gen3/4/5, SATA3, SPI, and I2C interfaces.
  • Experience leading small hardware design teams from concept through production.
  • Experience with PAM4, DDR5, PCIe Gen5 routing, larger board formats, layer-count optimization, and power supply design.
  • Familiarity with Cadence Allegro/OrCAD and strong knowledge of signal integrity, power integrity, decoupling, impedance, crosstalk, insertion loss, and return loss.
  • Hands-on experience with oscilloscopes, logic analyzers, mechanical and thermal considerations, and high-density component layouts.

Culture & Benefits

  • Full-time employment with bonus and equity plan eligibility, including new-hire equity grants and annual refreshers.
  • Employee stock purchase plan with a two-year lookback.
  • Family support programs and mental and physical health resources.
  • Recognition and service awards for contributions and milestones.
  • Export-controlled technology access may require eligibility under U.S. export control regulations and an export license review.

Hiring process

  • Interviews assess individual experience, technical reasoning, and communication skills in real time.
  • AI tools, transcription applications, automated answer generators, and automated note-taking bots are not permitted during interviews.

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