Electro-Optic Process Integration Engineer (Silicon Photonics)
Контакты
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Switzerland
process integrationsilicon photonicsdesign of experimentsadvanced packagingsemiconductor fabricationwafer level processingoptical device characterizationorganic electro optics
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Текст:
Hirify AI/Оригинал
TL;DR
Electro-Optic Process Integration Engineer (Silicon Photonics): Developing and integrating novel process steps and materials across silicon photonics manufacturing, assembly, packaging, and testing with an accent on scalable process development, design of experiments, and external partner collaboration. Focus on transferring processes from feasibility to production readiness, analyzing experimental results, and solving complex integration challenges across foundries, suppliers, and internal engineering teams.
Location: Adliswil, Switzerland
Company
Semiconductor technology company developing silicon photonics-based optical engines and components for enterprise, cloud, AI, carrier, and data center infrastructure.
What you will do
Identify and develop solutions for integrating novel process steps and materials across manufacturing, assembly, packaging, and testing.
Work with hardware, packaging, equipment, wafer-level, foundry, supplier, and other external partners to define and implement scalable processes.
Plan, execute, analyze, and document experiments in internal laboratories and with external partners.
Translate experimental results into concrete process improvements and transfer processes from feasibility through production readiness.
Coordinate across internal teams to integrate new processes into existing workflows and assembly sequences.
Requirements
Master’s degree and/or PhD in Electrical Engineering, Photonics, Material Science, or a related field.
3+ years of hands-on experience in process development or integration of novel materials in a photonics or semiconductor environment, including planning and executing DOEs and translating results into process improvements.
Systems-level understanding of the full manufacturing, assembly, packaging, and testing chain.
Broad familiarity with advanced packaging, wafer-level processing, PCB or board design, or work with OSATs and equipment manufacturers.
Solid grounding in integrated photonics device physics and semiconductor fabrication processes.
Experience working with external foundries or suppliers, including defining project scope and technical requirements, driving collaboration, and managing feedback loops.
Proactive, self-starting, hands-on approach with ownership of work and consistent delivery of high-quality results.
Ability to engage as a technical peer with internal cross-functional teams and external engineering partners, build productive long-term relationships, work through complex technical trade-offs independently, and communicate reasoning clearly.
Flexibility to adapt to shifting priorities, take on new responsibilities quickly, and execute consistently.
Nice to have
Background in organic electro-optics, organic photovoltaics, or organic electronics.
Experience with optical device characterization and testing.
Culture & Benefits
Flexible, open, highly international, diverse, and people-centered work environment.
Shared collaboration, transparency, and inclusivity.
Tools and resources to support professional growth and development.
Eligibility for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
Competitive compensation and benefits.
Hiring process
Interviews evaluate individual experience, thought process, and communication skills in real time.
AI tools, transcription applications, real-time answer generators, and automated note-taking bots are not permitted during interviews.
Applicants may undergo an export license review before employment if access to export-controlled technology or software is required.
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