Fusion GPS Engineer (Semiconductor)

Location: Tainan, Taiwan. Onsite role with travel required up to 50% of the time. Relocation is not available.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Develop service procedures, Best Known Methods, technical product manuals, Customer Engineering Notices, Internal Service Bulletins, and troubleshooting guides for new products.
• Participate in or lead first chamber build and testing in the applications laboratory, resolve issues, and support new product final testing with Engineering and Manufacturing.
• Partner with Quality & Reliability to address top field issues, manage CAPA activities, and conduct or facilitate failure analysis.
• Collect process and qualification data to create product Best Known Methods.
• Develop initial training packages and coordinate training for Customer Engineers, Process Engineers, and Technical Product Support before product shipments.
• Identify parts requiring stock and coordinate with AGS to ensure correct inventory locations.

Requirements

• Conceptual and practical expertise in the relevant discipline, with basic knowledge of related disciplines.
• Knowledge of best practices and how the function integrates with other business areas.
• Ability to solve complex problems using information from multiple sources and develop new perspectives on existing solutions.
• Ability to explain difficult or sensitive information and build consensus across teams.
• Availability to work in Tainan, Taiwan and travel up to 50% of the time.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs and employee support.
• Regular full-time employment with hirify.global.
• Equal opportunity employment environment.