leansix sigmafailure analysisroot cause analysisspcmanufacturing engineeringsmtssdpfmeamodule assembly
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
Очень мало
1325к-1987к TWD/год
3900к TWD4500к TWDмедиана5100к TWD
По похожим ролям (50) ~ 4500к TWD/год
На СНГ рынке: $1.9к/мес ($1.8к - $3к)
48
Не очень вакансия
развернуть
Зарплата значительно ниже ориентира платформы для похожих senior-позиций, что заметно снижает привлекательность предложения, несмотря на понятные задачи и зрелую продуктовую компанию.
Кликните для подробной информации
Ниже рынкаПонятные задачиСильная продуктовая база
Оценка от Hirify AI
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Backend Manufacturing Engineer-Sustaining (SSD): Sustaining high-volume SSD manufacturing at ODM sites in Shanghai or Taiwan with an accent on process quality, production output, cost targets, and manufacturing recipe control. Focus on qualifying processes and equipment, managing excursions and change control, driving root-cause analysis, and improving yield, stability, and manufacturing costs.
Location: Hybrid role based in Hsinchu, Taiwan, or Shanghai, China
Salary: TWD 1,324,800–1,987,200 per year
Company
hirify.global is a global memory technology company developing NAND memory and optimized data storage solutions.
What you will do
Sustain high-volume SSD manufacturing at ODM sites and ensure manufacturing processes and production output meet quality and cost targets.
Engage early with NPI process development teams to influence design for manufacturing, design for assembly, and HVM recipe deployment.
Develop and maintain SSD rework techniques, characterize manufacturing recipes, define critical-to-function process parameters, and qualify rework procedures.
Lead new site and production-line start-up or certification, process and equipment qualification, and engineering review and approval.
Drive yield, quality, process stability, and cost improvements through lean and continuous improvement projects.
Manage process changes and manufacturing excursions, including PCCB and MRB activities, failure analysis, root-cause investigation, risk mitigation, and corrective actions.
Requirements
Bachelor’s or master’s degree in science, mechanical engineering, materials engineering, or electrical/electronic engineering.
At least 5 years of experience in boards or modules manufacturing engineering.
Strong knowledge of SMT, module assembly, rework, material sourcing and qualification, assembly-related failure analysis, and excursion management.
Experience with 5-Whys root-cause analysis, PFMEA, DOE, SPC, troubleshooting, excursion control, and structured problem solving.
Strong communication, stakeholder influence, program management, and presentation skills.
Chinese proficiency is required; good English communication skills are required.
Nice to have
Experience with LEAN, Six Sigma, World Class Manufacturing, or other continuous improvement techniques.
Culture & Benefits
Work in a global memory technology organization with operations across the United States, Asia, Europe, and the Americas.
Collaborate with design, test and validation, quality, NPI, supply chain, and ODM supplier teams.
Contribute to an inclusive, diverse, collaborative, and results-driven working environment.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →