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2 дня назад

Principal Systems Hardware Engineer (AI)

195 000 - 285 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Principal Systems Hardware Engineer (AI): Own end-to-end system architecture for AI compute platforms, from concept and specifications through design reviews, validation, bring-up, and high-volume production deployment, with an accent on interconnect, board, chassis, rack-scale, power, and thermal architecture. Focus on defining scale-up and scale-out fabrics, evaluating cross-domain trade-offs, reviewing partner designs, and aligning hardware decisions with software performance and workload needs.

Location: Hybrid in Santa Clara, United States

Salary: $195K–$285K per year, plus equity and bonus opportunities.

Company

hirify.global develops software and hardware innovations that use generative AI to transform technology.

What you will do

  • Own end-to-end system architecture from concept and specification through design review, validation, bring-up, and production deployment.
  • Author system, board, and rack specifications and review partner and vendor designs against requirements.
  • Set technical direction for scale-up and scale-out interconnects, NICs, switches, optics, topology, boards, chassis, power, and thermal architecture.
  • Evaluate competing designs through trade-off analysis and what-if scenario planning across interconnect, power, thermal, and mechanical domains.
  • Partner with software teams to align hardware decisions with performance and workload needs.
  • Establish specification standards, review practices, and AI-assisted engineering workflows.

Requirements

  • 8+ years of experience in hardware systems architecture for large-scale compute or networking systems.
  • Hands-on expertise in at least one core domain: interconnect, power, or thermal.
  • Experience owning architecture at machine, rack, row, or cluster scale from specification through high-volume production deployment.
  • Experience reviewing partner designs and holding vendors to specifications.
  • Technical leadership experience driving directional decisions and alignment across teams and partners.
  • Degree in electrical engineering, computer engineering, mechanical engineering, computer science, or equivalent.

Nice to have

  • Experience with hyperscale, HPC, AI/ML, high-end networking, or AI accelerator platforms.
  • Experience with scale-up and scale-out fabrics, chip-package-system co-design, or new engineering functions and practices.
  • Expertise in high-speed SerDes, PCIe, CXL, optics, BMC/firmware, secure boot, 48V/HVDC power, liquid cooling, fleet-scale RAS, signal integrity, or power integrity.

Culture & Benefits

  • Respectful, collaborative, and inclusive working environment.
  • Direct communication, humility, and execution-focused collaboration.
  • Medical, dental, and vision coverage.
  • 401(k) and rewards focused on employee and family wellbeing.
  • Individual and company performance incentives.

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