Staff Advanced Packaging/Process Engineer of R&D (Photonics)

Location: San Jose, California, United States

Salary: $112,050–$160,050 per year

Company

hirify.global develops optical and photonic solutions for high-speed networks, AI, cloud computing, data centers, telecommunications, and advanced manufacturing.

What you will do

• Lead the design, development, and optimization of advanced packaging processes for optical and photonic products from concept through high-volume manufacturing.
• Perform hands-on process development, characterization, and troubleshooting across die attach, wire bonding, flip-chip, optical alignment, hermetic sealing, and advanced interconnection technologies.
• Develop process controls, statistical process control, and design of experiments to improve yield, reliability, and manufacturability.
• Collaborate with design, product engineering, reliability, and manufacturing teams to transfer packaging technologies into production.
• Evaluate materials, equipment, and manufacturing techniques while conducting root-cause analysis and corrective actions.
• Document process specifications, manufacturing instructions, and test procedures; mentor junior engineers and provide technical leadership.

Requirements

• Master’s or Ph.D. in electrical engineering, mechanical engineering, materials science, physics, or a related discipline.
• 8+ years of advanced packaging or process engineering experience in optoelectronics, photonics, or semiconductors, with a strong R&D focus.
• Expertise in packaging technologies including chip-on-board, flip-chip, wafer-level packaging, system-in-package, hermetic sealing, and optical assembly.
• Experience with wire bonding, thermocompression bonding, epoxy attach, packaging equipment, and optical alignment systems.
• Knowledge of materials science, statistical process control, design of experiments, and failure analysis.
• Strong problem-solving, analytical, communication, independent-working, and collaboration skills.

Nice to have

• Experience with CAD tools for package design and simulation.
• Knowledge of industry trends and emerging technologies in advanced packaging.

Culture & Benefits

• Flexible time off.
• Physical and mental health and wellness benefits.
• Tuition reimbursement and career growth support.
• Free gym, games room, prayer room, subsidized meals, and complimentary coffee and tea.
• Employee stock options and incentive plans.
• Collaborative, innovative, and inclusive workplace.