Photonic System Design Engineer (Silicon Photonics)

Location: US, California, Santa Clara. Hybrid work model with time split between the assigned hirify.global site and off-site work.

Annual salary: $164,470–$269,100 USD.

Company

hirify.global designs and manufactures silicon products and develops technologies for connected digital devices.

What you will do

• Define and drive photonics component development while influencing photonic integrated-circuit architecture.
• Architect, design, simulate, and develop lasers, semiconductor optical amplifiers, passive components, high-speed detectors, modulators, and III-V solutions on silicon platforms.
• Perform tolerance analysis and optimize components for performance, power, area, and reliability.
• Coordinate test-chip execution across design, layout, tapeout, testing, and validation.
• Analyze characterization data, identify performance gaps, and drive improvement paths.
• Develop photonics system modeling and test methodologies and lead research into next-generation components and hirify.globallectual property.

Requirements

• Master’s degree in Electrical Engineering, Physics, or a similar discipline focused on silicon photonics, optical components, modules, or transmission systems, plus 6+ years of industry experience; or a PhD plus 4+ years of industry experience.
• Experience with system link modeling and design methodologies for 50–200 GBaud optical communication transceivers and CPO/OCI engine products.
• Experience architecting and designing high-speed silicon photonics commercial optical communication systems and components.
• Experience modeling direct-detect higher-order modulation, advanced modulation, noncoherent, and coherent optical systems.
• Experience with optical and electrical simulation platforms such as Simulink, Matlab, ADS, Lumerical, HFSS, or VPI.

Nice to have

• Experience with transmitter, receiver, analog, SerDes, silicon, III-V photonic-device, DSP, coding, decoding, OSNR, BER, and FEC modeling.
• Experience designing high-speed optoelectronic and electronic components and optimizing drivers, modulators, RF packages, carriers, and high-speed interconnects.
• Exposure to optical system, subsystem, and component characterization, optical testing, and 2D, 2.5D, and 3D packaging concepts.

Culture & Benefits

• Hybrid work model combining on-site and off-site work.
• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• Full-time experienced-hire position on Shift 1 in the United States.