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9 дней назад

Lead Power Systems Engineer (Semiconductor)

250 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Lead Power Systems Engineer (Semiconductor): Own power-delivery architecture for high-density heterogeneous semiconductor systems combining GaN, silicon, glass, and diamond, with an accent on power conversion, distribution, physical integration, and measured hardware performance. Focus on quantifying efficiency, power density, transient response, thermal performance, and reliability trade-offs while leading hardware bring-up, measurement, and debug.

Location: Boston, Massachusetts, United States

Salary: Up to $250,000 base per year

Company

Early-stage semiconductor development focused on a multi-material 3D integration platform combining GaN, silicon, glass, and diamond to address electrical, packaging, and thermal challenges.

What you will do

  • Lead power-delivery architecture from option evaluation and trade studies through delivered hardware.
  • Define power conversion and distribution approaches around electrical, thermal, packaging, and system requirements.
  • Quantify trade-offs across efficiency, power density, transient response, thermal performance, and reliability.
  • Collaborate with circuit, RF, packaging, and systems engineers to resolve integration challenges.
  • Own hardware bring-up, measurement, and debugging, using results to refine designs.
  • Help establish engineering methods and technical priorities within a founding-stage team.

Requirements

  • Experience leading power-delivery architecture or power systems for complex hardware, with responsibility from trade studies through implementation.
  • Strong understanding of power conversion and distribution and the impact of physical integration on performance.
  • Experience validating engineering trade-offs through calculations, modelling, and hardware measurements.
  • Direct ownership of hardware bring-up and debugging.
  • Experience working across electrical, thermal, mechanical, or packaging boundaries.
  • Ability to work autonomously and remain hands-on as requirements evolve.

Nice to have

  • Experience in semiconductor systems, advanced packaging, compute, data centers, aerospace, or similarly demanding power-electronics environments.

Culture & Benefits

  • Foundational technical ownership within a new semiconductor platform.
  • Direct collaboration with the founding team.
  • Broad responsibility across power delivery, packaging, and thermal design.
  • Direct connection between engineering decisions and working hardware.

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