2 дня назад
Photonic IC Layout & Design Flow Engineer (AI)
160 000 - 250 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Photonic IC Layout & Design Flow Engineer (AI): Building and owning Cadence-based photonic IC layout, verification, signoff, and tape-out workflows for a GlobalFoundries 45 nm optical-electronic computing platform with an accent on silicon photonics, PDK development, and PIC/EIC integration. Focus on completing industry PIC tape-outs, resolving photonic-electronic-packaging interfaces, and connecting silicon characterization results with design improvements.
Location: United States; conditions mention Berkeley, California, the San Francisco Bay Area, Boston, Massachusetts, and Texas
Salary: $160,000–$250,000 per year; additional listed salary ranges include $150,000–$220,000, $200,000–$300,000, $260,000–$300,000, and up to $250,000 base
Company
is hiring for a photonic computing company developing an integrated optical-electronic platform for AI workloads.
What you will do
- Own chip-level photonic IC layout, component integration, PDK checks, DRC/LVS, signoff, and tape-out readiness.
- Establish and improve the Cadence-based photonics workflow for the GlobalFoundries 45 nm process.
- Build repeatable PDK, layout, and verification workflows for complete chip delivery.
- Integrate the photonic design flow with electronic IC development and resolve PIC, EIC, and packaging interface requirements.
- Work with measurement and characterization engineers to connect silicon results with design improvements.
- Provide technical direction to photonic engineers while remaining hands-on with implementation and verification.
Requirements
- At least one complete industry PIC tape-out with direct responsibility for chip-level layout, verification, and signoff.
- Strong practical experience with Cadence Photonics, Virtuoso, or a closely related commercial PIC flow.
- Experience building or improving design flows rather than only using an established workflow.
- Strong understanding of silicon-photonics device physics, with meaningful device or circuit design and simulation experience.
- Practical collaboration experience with electronic IC, packaging, measurement, and characterization engineers.
- Ability to coordinate specialist designers and remain accountable for complete chip delivery.
Culture & Benefits
- Direct access to founders and close collaboration across photonics, electronics, packaging, and lab validation.
- Opportunity to shape engineering workflows and decisions that move research silicon toward a commercial system.
- The first six months focus on completing the Cadence Photonics workflow and integrating it with the EIC design flow.
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