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2 дня назад

Photonic IC Layout & Design Flow Engineer (AI)

160 000 - 250 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Photonic IC Layout & Design Flow Engineer (AI): Building and owning Cadence-based photonic IC layout, verification, signoff, and tape-out workflows for a GlobalFoundries 45 nm optical-electronic computing platform with an accent on silicon photonics, PDK development, and PIC/EIC integration. Focus on completing industry PIC tape-outs, resolving photonic-electronic-packaging interfaces, and connecting silicon characterization results with design improvements.

Location: United States; conditions mention Berkeley, California, the San Francisco Bay Area, Boston, Massachusetts, and Texas

Salary: $160,000–$250,000 per year; additional listed salary ranges include $150,000–$220,000, $200,000–$300,000, $260,000–$300,000, and up to $250,000 base

Company

hirify.global is hiring for a photonic computing company developing an integrated optical-electronic platform for AI workloads.

What you will do

  • Own chip-level photonic IC layout, component integration, PDK checks, DRC/LVS, signoff, and tape-out readiness.
  • Establish and improve the Cadence-based photonics workflow for the GlobalFoundries 45 nm process.
  • Build repeatable PDK, layout, and verification workflows for complete chip delivery.
  • Integrate the photonic design flow with electronic IC development and resolve PIC, EIC, and packaging interface requirements.
  • Work with measurement and characterization engineers to connect silicon results with design improvements.
  • Provide technical direction to photonic engineers while remaining hands-on with implementation and verification.

Requirements

  • At least one complete industry PIC tape-out with direct responsibility for chip-level layout, verification, and signoff.
  • Strong practical experience with Cadence Photonics, Virtuoso, or a closely related commercial PIC flow.
  • Experience building or improving design flows rather than only using an established workflow.
  • Strong understanding of silicon-photonics device physics, with meaningful device or circuit design and simulation experience.
  • Practical collaboration experience with electronic IC, packaging, measurement, and characterization engineers.
  • Ability to coordinate specialist designers and remain accountable for complete chip delivery.

Culture & Benefits

  • Direct access to founders and close collaboration across photonics, electronics, packaging, and lab validation.
  • Opportunity to shape engineering workflows and decisions that move research silicon toward a commercial system.
  • The first six months focus on completing the Cadence Photonics workflow and integrating it with the EIC design flow.

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