RF Technology Development Epitaxy and Integration Engineer – Principal Engineer (Semiconductor)

Location: Essex Junction, United States

Salary: $85,000–$146,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services through a global manufacturing footprint.

What you will do

• Develop, evaluate, and qualify CVD silicon and SiGe epitaxial processes.
• Define epitaxial growth conditions and control methodologies that meet technology performance and manufacturability requirements.
• Develop, optimize, and qualify FEOL semiconductor devices and processes for performance, cost, and yield.
• Drive integration optimization using DOE methodologies, statistical analysis, and yield-learning techniques.
• Partner with unit process, failure analysis, and characterization engineers to improve device performance and yield.
• Resolve technical process problems, support customers, and establish design rules, test structures, and test methodologies.

Requirements

• Master’s or PhD in Electrical Engineering, Materials Science, or a related engineering or physical science discipline.
• Hands-on experience with epitaxial growth techniques, including silicon or III-V materials.
• At least a 3.0 overall GPA and good academic standing.
• Written and verbal English fluency required.
• Ability to work safely and support Environmental, Health, Safety, and Security programs.

Nice to have

• At least two years of experience in silicon or SiGe BiCMOS FEOL or BEOL processing, III-V processing, or semiconductor process development.
• At least two years of relevant epitaxial growth engineering experience.
• Knowledge of semiconductor device physics and RF fundamentals, such as S-parameters.
• Prior internship or co-op experience, leadership experience, project management skills, and strong planning and communication skills.

Culture & Benefits

• Full-time employment opportunities for recent graduates.
• Accelerated training in a fast-paced work environment.
• Cross-functional collaboration and talent mobility opportunities.
• Mentorship, networking, and leadership development.