6 дней назад
Defect Characterization Low Yield Analysis Engineer (Semiconductor)
133 800 - 188 890$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Defect Characterization Low Yield Analysis Engineer (Semiconductor): Leading root cause investigations and yield improvement for advanced packaging assembly and substrate technology programs with an accent on failure analysis, characterization methodologies, and cross-functional manufacturing collaboration. Focus on analyzing defects with microscopy and materials characterization tools, correlating large data sets to identify yield limiters, and driving corrective actions for complex technical problems.
Location: On-site in Phoenix, Arizona, United States
Annual salary: $133,800–$188,890 USD
Company
develops semiconductor technologies and advanced packaging and substrate manufacturing solutions.
What you will do
- Lead end-to-end investigations into complex yield, defect, quality, and reliability issues.
- Own technical investigations for factory, platform, and technology development programs.
- Define characterization strategies, learning plans, and root cause methodologies.
- Use optical microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.
- Correlate characterization results with electrical, inspection, process history, and manufacturing data.
- Develop dashboards, automation, analytical workflows, and corrective actions to improve yield and analysis efficiency.
Requirements
- Master’s degree in materials science, mechanical engineering, chemical engineering, electrical engineering, chemistry, physics, or a related field with 3+ years of relevant semiconductor or failure analysis laboratory experience, or a PhD in a related field.
- Hands-on experience with failure analysis and characterization techniques in a laboratory environment.
- Ability to independently drive technical investigations, identify root causes, and implement corrective actions.
- Experience analyzing large data sets using statistical methods and coding tools.
- Strong technical communication, problem-solving, troubleshooting, and prioritization skills.
- Ability to work on-site in Phoenix, Arizona.
Nice to have
- Experience with TEM, XRD, planar grinding, advanced sample preparation, or similar characterization methods.
- Advanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.
- Proficiency with Python, JMP, JSL, SQL, or equivalent data analytics tools.
- Experience mentoring engineers and technicians or developing new characterization techniques and analytical workflows.
Culture & Benefits
- Collaborative work across manufacturing, quality, process integration, design, and technology development organizations.
- Lab-based technical environment with opportunities to mentor engineers and technicians.
- Health, retirement, and vacation benefits.
- Competitive pay and stock bonuses.
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