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6 дней назад

Defect Characterization Low Yield Analysis Engineer (Semiconductor)

133 800 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Defect Characterization Low Yield Analysis Engineer (Semiconductor): Leading root cause investigations and yield improvement for advanced packaging assembly and substrate technology programs with an accent on failure analysis, characterization methodologies, and cross-functional manufacturing collaboration. Focus on analyzing defects with microscopy and materials characterization tools, correlating large data sets to identify yield limiters, and driving corrective actions for complex technical problems.

Location: On-site in Phoenix, Arizona, United States

Annual salary: $133,800–$188,890 USD

Company

hirify.global develops semiconductor technologies and advanced packaging and substrate manufacturing solutions.

What you will do

  • Lead end-to-end investigations into complex yield, defect, quality, and reliability issues.
  • Own technical investigations for factory, platform, and technology development programs.
  • Define characterization strategies, learning plans, and root cause methodologies.
  • Use optical microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.
  • Correlate characterization results with electrical, inspection, process history, and manufacturing data.
  • Develop dashboards, automation, analytical workflows, and corrective actions to improve yield and analysis efficiency.

Requirements

  • Master’s degree in materials science, mechanical engineering, chemical engineering, electrical engineering, chemistry, physics, or a related field with 3+ years of relevant semiconductor or failure analysis laboratory experience, or a PhD in a related field.
  • Hands-on experience with failure analysis and characterization techniques in a laboratory environment.
  • Ability to independently drive technical investigations, identify root causes, and implement corrective actions.
  • Experience analyzing large data sets using statistical methods and coding tools.
  • Strong technical communication, problem-solving, troubleshooting, and prioritization skills.
  • Ability to work on-site in Phoenix, Arizona.

Nice to have

  • Experience with TEM, XRD, planar grinding, advanced sample preparation, or similar characterization methods.
  • Advanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.
  • Proficiency with Python, JMP, JSL, SQL, or equivalent data analytics tools.
  • Experience mentoring engineers and technicians or developing new characterization techniques and analytical workflows.

Culture & Benefits

  • Collaborative work across manufacturing, quality, process integration, design, and technology development organizations.
  • Lab-based technical environment with opportunities to mentor engineers and technicians.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.

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