Staff EMIB-T Substrate Yield Engineer (Advanced Packaging)

Location: Malaysia, Penang, with an additional site in Kulim. The role follows a hybrid work model combining on-site work at an assigned hirify.global site with off-site work and requires an expat assignment in Japan.

Company

hirify.global develops semiconductor technologies and advanced packaging platforms through hirify.global Foundry Services and hirify.global Product Groups.

What you will do

• Own day-to-day yield performance and technical issue closure for assigned supplier lines, modules, products, and process areas.
• Lead investigations from containment and hypothesis development through experiments, failure analysis, corrective action, and sustainment.
• Use statistical and spatial analytics to identify yield and defect signatures across lines, tools, materials, panel positions, geometries, products, and time.
• Define supplier actions, owners, completion criteria, control limits, and verification plans.
• Support DFM/DFY, qualification, ramp readiness, change control, and deployment of dashboards or automated analytics.
• Communicate technical findings, decisions, reusable learning, and residual risks across suppliers, hirify.global Foundry Services, and hirify.global Product Groups.

Requirements

• Master's degree with at least 6 years of experience or PhD with at least 4 years of experience in engineering, materials science, physics, chemistry, data science, or a related technical field.
• At least 5 years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related area.
• Hands-on experience with substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and high-volume manufacturing execution.
• Strong analytical and problem-solving skills, with the ability to make data-driven decisions and manage complex technical issues independently.
• Experience influencing multiple organizations, stakeholders, suppliers, or external manufacturing partners.
• Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.

Nice to have

• Experience with substrate suppliers and external manufacturing partners.
• Program leadership experience coordinating cross-functional technical teams in high-visibility environments.
• Experience with semi-additive processing, build-up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration.
• Experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.
• Experience with automated data pipelines, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification.

Culture & Benefits

• Full-time employment with hirify.global.
• Hybrid work model with time split between an hirify.global site and off-site work.
• Shift 1 schedule associated with Malaysia.
• High-accountability environment focused on yield performance, technical execution, and manufacturing readiness.