aidata analysisprocess modelingdesign of experimentsquantumadvanced packaginghybrid bondingsemiconductor integration
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Текст:
Hirify AI/Оригинал
TL;DR
APL Quantum Intern (Summer 2027) (Advanced Semiconductor Packaging): Developing and analyzing quantum advanced packaging processes, including wafer-to-wafer and die-to-wafer hybrid bonding, TSV/TOV, and interposers, with an accent on design of experiments, process integration, and engineering data analysis. Focus on modeling process performance, executing experiments with semiconductor tooling, and communicating technical findings to project stakeholders.
Location: USA - New York - Malta
Salary: $20.00–$40.00 per hour
Company
hirify.global manufactures essential semiconductors and develops power-efficient, high-performance solutions for growth markets including AI.
What you will do
Contribute to quantum advanced packaging development, including wafer-to-wafer and die-to-wafer hybrid bonding.
Support through-silicon via/through-oxide via (TSV/TOV) and interposer development.
Plan and perform design-of-experiments using semiconductor tooling and equipment at external partners.
Analyze engineering data from experiments, process optimization, and development activities.
Develop or support process models and assist with integration, process development, documentation, and problem-solving.
Communicate experimental results, technical findings, and recommended next steps to project stakeholders.
Requirements
At least a sophomore pursuing a Bachelor’s or Master’s degree in Engineering or a related field at an accredited institution.
Overall GPA of at least 3.0 and good academic standing.
Fluent written and verbal English.
Availability to work at least 40 hours per week during the internship.
Ability to travel up to 10%.
Nice to have
Prior internship or co-op experience and demonstrated leadership experience.
Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis.
Project management, planning, organizational, written communication, and verbal communication skills.
Interest in using AI tools and emerging technologies to improve productivity and decision-making.
Current PhD studies in Engineering or a related field, or availability for a six-month co-op assignment.
Culture & Benefits
One-on-one mentorship and work assignments focused on professional growth.
Professional development opportunities and networking with executives.
Participation in a global semiconductor internship pipeline.
Work conducted in accordance with Environmental, Health, Safety & Security requirements.
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