Module Engineering PhD Intern 2027 (Semiconductor Manufacturing)

Location: Onsite in Hillsboro, Oregon, United States

Annual salary range: $120,898–$120,902 USD

Company

hirify.global develops and manufactures semiconductor technologies and operates high-volume manufacturing organizations.

What you will do

• Lead a meaningful engineering project from problem definition through execution and final presentation.
• Support high-volume manufacturing of advanced semiconductor technologies through process improvement, manufacturing efficiency, equipment performance, automation, data analytics, quality systems, or operational excellence initiatives.
• Analyze manufacturing, equipment, and operational data to support engineering decisions and identify improvement opportunities.
• Collaborate with engineers, technicians, quality teams, operations teams, and other technical and business stakeholders.
• Apply structured problem-solving and continuous improvement methods.
• Prepare technical documentation, recommendations, reports, dashboards, and presentations.

Requirements

• Currently pursuing a PhD in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
• Minimum GPA of 3.0 and at least 3 months of educational, research, laboratory, internship, or industry experience.
• Academic coursework or research experience in semiconductor processing, materials science, microelectronics, advanced materials, or a related field.
• Availability for a minimum 10–12-week summer internship and ability to work onsite in Hillsboro, Oregon.
• Strong problem-solving, data analysis, technical communication, presentation, collaboration, and prioritization skills.
• Ability to learn quickly, take initiative, and communicate technical concepts to diverse audiences.

Nice to have

• Experience in semiconductor manufacturing, process engineering, manufacturing, data analytics, process development, equipment engineering, or quality systems.
• Experience with Python, JMP, MATLAB, Power BI, Excel, SQL, or similar data analysis and visualization tools.
• Knowledge of root cause analysis, 8D, SPC, Pareto analysis, Design of Experiments, Lean, or Six Sigma.
• Experience with automation or scripting, materials science, device fabrication, technical documentation, dashboards, or project presentations.

Culture & Benefits

• Hands-on experience in a fast-paced, high-volume semiconductor manufacturing environment.
• Mentorship, training, networking, and collaboration across engineering disciplines.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Opportunities to evaluate potential future full-time engineering opportunities.