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5 дней назад

Module Development Defect Metrology Engineer (Semiconductor Manufacturing)

155 520 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Module Development Defect Metrology Engineer (Semiconductor Manufacturing): Developing and optimizing defect inspection metrology tools for semiconductor packaging and high-volume manufacturing with an accent on tool selection, process integration, automation, and equipment development. Focus on building technology roadmaps, applying statistical process control and data analytics, and solving complex scalability and process stability challenges.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $155,520–$219,550 USD

Company

hirify.global's Advanced Packaging Technology Development organization develops next-generation semiconductor packaging solutions and manufacturing technologies for high-volume production.

What you will do

  • Lead development of manufacturing metrology and defect inspection tools, including tool selection, automation optimization, equipment metrology, and system integration.
  • Develop process and hardware solutions for defect inspection in high-volume manufacturing and future technology programs.
  • Create and execute technology roadmaps for future manufacturing needs.
  • Partner with equipment and material suppliers to implement enabling process technologies.
  • Optimize production efficiency, manufacturing methods, output, and operational equipment scalability.
  • Apply statistical process control and data analytics to improve process stability and continuous improvement.

Requirements

  • Bachelor's degree in a relevant STEM field with 6+ years of semiconductor experience, or a master's degree with 4+ years, or a PhD with 2+ years.
  • At least 2 years of experience in manufacturing process development, statistical process control, and process improvement methodologies.
  • Hands-on experience with wafer-level assembly, semiconductor processing, or advanced packaging technology and defect inspection method development.
  • Experience leading programs from strategy formation through high-volume production and continuous improvement.
  • Technical leadership and the ability to solve complex engineering challenges across yield, operations, supplier management, and other functions.

Nice to have

  • Metrology experience with advanced packaging technologies such as hybrid bonded interconnects, ultra-fine pitch solder connections, or RDL-based packaging.

Culture & Benefits

  • On-site work model with Shift 1 scheduling.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.
  • Collaboration with cross-functional teams and external equipment and material suppliers.

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