5 дней назад
RF/PCB Design Engineer (Quantum Hardware)
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
RF/PCB Design Engineer (Quantum Hardware) (RF/microwave, cryogenic quantum hardware): Designing critical microwave components, high-density cryogenic PCB layouts, and packaging solutions for next-generation 3D quantum processors with an accent on impedance matching, signal integrity, and cryogenic integration. Focus on validating hardware from room temperature to millikelvin conditions, solving insertion-loss and cross-talk challenges, and integrating design processes into automated workflows.
Location: Delft, Netherlands; on-site with a hybrid setup
Company
develops high-performance quantum processors using its VIO™ quantum processing unit architecture.
What you will do
- Design critical electromechanical components serving as interfaces for quantum processors and traveling-wave parametric amplifiers.
- Develop PCB, silicon chip, and PCB-to-chip interconnect layouts for the vertical VIO architecture using CAD tools.
- Solve RF and microwave design challenges involving insertion loss, impedance matching, cross-talk, shielding, and signal integrity.
- Design and validate hardware for operation from room temperature down to millikelvin conditions in dilution refrigerators.
- Account for thermal cycling, differential contraction, and material behavior during cryogenic testing and characterization.
- Embed hardware design processes into automated workflows and collaborate with packaging and product design teams.
Requirements
- BSc or MSc in Electrical Engineering, with a focus on PCB design, layout, and RF/microwave engineering.
- At least 4 years of hands-on PCB design experience with KiCAD, Altium Designer, and Cadence.
- Hands-on experience designing or testing hardware for cryogenic environments, such as dilution refrigerators, cryostats, or low-temperature RF/microwave systems.
- Strong knowledge of schematics, electromechanical interfaces, RF layout trade-offs, temperature-dependent behavior, shielding, signal integrity, and impedance analysis.
Nice to have
- Experience with cofired ceramic boards such as LTCC or HTCC.
- Background in high-density interconnects, high-frequency flex interconnects, 3D packaging, or advanced integration.
- Familiarity with superconducting technologies.
- Practical RF testing and measurement experience using a VNA and related laboratory equipment.
Culture & Benefits
- High-performing environment with world-class technical experts and ambitious product goals.
- Competitive salary with an 8% holiday allowance.
- Pension plan with partner and dependent coverage.
- Flexible, outcome-focused working arrangements, hybrid work, and an open vacation policy.
- Learning and development budget tailored to individual goals and development needs.
- Team events, offsites, and opportunities to celebrate achievements together.
Hiring process
- Pre-employment screening may be required.
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