Engineering Manager, Night Shift (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States. Night shift from 6:00 PM to 6:00 AM on an alternating 3- and 4-day schedule. Openings are available on Shift 4 and Shift 6.

Annual salary: $115,110–$219,550 USD

Company

hirify.global develops semiconductor technologies, including advanced chip design, manufacturing, packaging, and substrates technology.

What you will do

• Lead approximately 12 on-shift engineers supporting advanced substrates technology development across the CH1 and CH8 factories.
• Act as the primary engineering escalation point and respond to MEOS and Emergency Operations Center events.
• Lead structured problem-solving activities, SWATs, and task forces for complex tool and process issues.
• Improve factory safety, quality, output velocity, yield, capacity, and capability across shifts.
• Develop staffing plans, capability roadmaps, career development programs, and retention strategies for the engineering team.
• Collaborate with Factory Operations, Equipment Engineering, Module Engineering, and Facilities Engineering.

Requirements

• Bachelor’s degree in engineering or a related field with 4+ years of relevant experience, or a master’s degree with 3+ years of relevant experience, or a PhD in engineering or a related field.
• At least 1 year of experience as a Team Lead or First Line Manager in a technical or engineering environment.
• Domain-specific knowledge of semiconductor fabrication or package, assembly, and test operations.
• Availability for an on-site night-shift role in Phoenix, Arizona within a 24x7 compressed work week operation.
• Strong leadership, communication, collaboration, coaching, analytical thinking, and problem-solving skills.

Nice to have

• 2+ years of experience in a 24x7 factory environment.
• 2+ years of hands-on experience in semiconductor fabrication or package, assembly, and test operations.
• Experience resolving ambiguous issues involving tools, processes, and tool-facility interactions.

Culture & Benefits

• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Opportunities to develop engineering talent through coaching, mentoring, and career planning.
• Work in advanced semiconductor packaging and manufacturing facilities.
• Emergency Response Team and Incident Commander certification is expected within the first year.