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10 дней назад

SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) (Advanced Packaging): Developing, optimizing, and qualifying advanced packaging processes for wafer bonding, Die-to-Wafer integration, TSV, and related technologies with an accent on process performance, yield, reliability, and manufacturing readiness. Focus on designing experiments, qualifying equipment, solving complex process and yield issues, and transferring robust processes into high-volume manufacturing.

Location: Singapore

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services through a global manufacturing footprint.

What you will do

  • Develop, optimize, and qualify advanced packaging processes including Bond/Debond, Plasma, UV, Cleaning, Die Reconstitution, Annealing, and TSV technologies.
  • Design, execute, and analyze experiments to achieve performance, yield, reliability, stability, and cost targets.
  • Start up and qualify new processes and equipment, support equipment acceptance, and perform tool matching and R&R evaluations.
  • Improve process robustness and equipment productivity for high-volume manufacturing using DOE, statistical tools, lean manufacturing, and Six Sigma.
  • Resolve complex process, equipment, and yield issues while supporting integration, quality, qualification, and reliability activities.
  • Lead continuous improvement programs, establish process optimization strategies, and coach engineers on advanced packaging etch processes.

Requirements

  • BS, Master’s, or PhD in Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics, or a related engineering discipline.
  • At least 7 years of relevant advanced packaging process experience.
  • Experience leading fab-wide, cross-module process development projects.
  • Working experience with advanced packaging process tools and technologies such as Si interposer, Die-to-Wafer, and Wafer-to-Wafer integration.
  • Strong verbal and written communication skills, interpersonal skills, and the ability to work effectively across cultures.
  • Ability to take charge of group development needs and conduct projects that improve quality, cost, yield, or productivity.

Culture & Benefits

  • Work in a multicultural and inclusive environment supporting collaboration, innovation, and respect.
  • Participate in environmental, health, safety, and security programs.
  • Employment is subject to applicable background checks, medical screenings, and local laws.
  • hirify.global does not charge candidates recruitment fees.

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