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11 дней назад

Operations Director (Semiconductor Manufacturing)

Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Operations Director (Semiconductor Manufacturing): Establishing and scaling Wafer Test and Back Grind manufacturing operations in Seremban with an accent on factory readiness, qualification, production ramp-up, and high-volume performance. Focus on building manufacturing systems and teams, commercializing advanced package technologies, and optimizing yield, throughput, OEE, productivity, delivery, and cost.

Location: Seremban, Malaysia

Company

hirify.global develops semiconductor technologies for essential applications and is establishing advanced manufacturing operations.

What you will do

  • Lead the start-up, commissioning, qualification, and ramp-up of Wafer Test and Back Grind operations.
  • Establish factory readiness, manufacturing systems, automation solutions, and workforce capability.
  • Lead manufacturing, engineering, maintenance, planning, logistics, and industrial engineering activities.
  • Drive the transition from qualification to stable high-volume manufacturing while managing yield, throughput, cycle time, OEE, productivity, delivery, and manufacturing cost.
  • Lead the qualification and commercialization of TSSOP, VSSOP, and high-pin-count DHVQFN package technologies.
  • Build a high-performing operations organization and partner with engineering, quality, supply chain, and external manufacturing teams.

Requirements

  • Bachelor’s degree in engineering, electronics, semiconductor technology, manufacturing engineering, or a related discipline.
  • 10+ years of leadership experience in semiconductor manufacturing.
  • Proven experience with manufacturing start-ups, greenfield projects, technology transfers, production ramps, or major capacity expansions.
  • Deep knowledge of semiconductor backend manufacturing, including wafer test, wafer back grinding, packaging, and high-volume production.
  • Strong understanding of TSSOP, VSSOP, and DHVQFN package technologies.
  • Experience with Lean Manufacturing, Six Sigma, SPC, FMEA, APQP, DOE, OEE management, structured problem solving, digital manufacturing, automation, data analytics, and Industry 4.0.

Nice to have

  • Master’s degree or MBA.

Culture & Benefits

  • Leadership culture focused on accountability, safety, quality, employee engagement, and operational excellence.
  • Opportunities to develop talent, support succession planning, and enable employee growth.
  • Inclusive and accessible recruitment process with reasonable adjustments available where requested.
  • Employee resource groups, including Pride Network and global and local Women’s groups.

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