Engineer I Process Grinding and Lamination (Semiconductor)

Location: Philippines – Mphil 3; onsite

Company

hirify.global develops semiconductor technologies and products for global markets, with a large international workforce and a focus on innovation, employee development, and manufacturing excellence.

What you will do

• Develop, characterize, qualify, and industrialize wafer backgrinding and thinning processes for advanced packaging platforms, including WLCSP, BGA, MDQFN, and Fan-Out.
• Define process architectures, flows, critical parameters, operating windows, specifications, control plans, and qualification reports.
• Evaluate and implement grinding technologies, materials, consumables, equipment, temporary wafer mounting systems, and handling solutions.
• Lead technology transfer from development through pilot production and high-volume manufacturing.
• Support manufacturing during technology ramp and early production, then drive process stabilization and continuous improvement.
• Act as a subject matter expert in wafer and panel backgrinding, grinding wheel technologies, thin wafer processing, warpage management, and tape lamination, detaping, and curing.

Requirements

• Bachelor’s degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, or a related engineering discipline.
• At least 3 years of semiconductor manufacturing experience with direct experience in backgrinding and tape lamination processes.
• Experience with Design of Experiments, Minitab or JMP, Statistical Process Control, FMEA, GRR, and Six Sigma tools.
• Knowledge of process characterization, recipe creation, equipment and process troubleshooting, SPC chart interpretation, safety protocols, and cleanroom practices.
• Strong analytical, problem-solving, communication, teamwork, leadership, mentoring, and attention-to-detail skills.
• Proficiency in Microsoft Office and maintenance management systems.

Nice to have

• Experience with Fan-In, Fan-Out, or other advanced packaging tools.

Culture & Benefits

• Work within a large global semiconductor organization focused on trust, empowerment, respect, diversity, and communication.
• Access employee development and leadership growth programs.
• Join a team-oriented environment with opportunities to contribute to innovation and continuous improvement.