Principal Process Integration Engineer (3D NAND)

Location: Hybrid work based in California, with frequent travel to China and other sites

Salary: $221,360–$354,200 yearly

Company

hirify.global develops NAND memory technologies and optimized data storage solutions as part of a global memory technology organization.

What you will do

• Define process flows and process target specifications for customer product requirements.
• Lead multidisciplinary teams through product qualification and manufacturing transfer.
• Identify and resolve process-related issues using model-based problem-solving methods.
• Apply statistical tools to support data-driven decisions improving performance, reliability, and yield.
• Drive cost-effective continuous improvement initiatives for semiconductor manufacturing processes.
• Collaborate with device, product engineering, design, manufacturing, reliability, and quality assurance teams to transfer new technologies into high-volume production.

Requirements

• MS or PhD in Electrical Engineering, Material Science, or a relevant field.
• 10+ years of experience in semiconductor process engineering.
• Broad and deep knowledge of semiconductor processing techniques and device physics.
• Strong analytical, problem-solving, communication, and attention-to-detail skills.
• Leadership experience with multidisciplinary teams and the ability to manage multiple projects independently.
• Ability to work in a hybrid role based in California and travel frequently to China and other sites.

Culture & Benefits

• Collaborative, fast-paced office environment with cross-functional teamwork.
• Medical, dental, vision, life, AD&D, and disability insurance.
• Healthcare and dependent care flexible spending accounts.
• Company match on eligible 401(k) contributions.
• Eligibility for RSU, RCU, and cash bonus programs.