Defect Metrology Engineer (Semiconductor)

Location: Hybrid role based at an hirify.global site in Phoenix, Arizona or Hillsboro, Oregon, United States; employees split time between on-site and off-site work.

Annual salary: $115,110–$219,550 USD.

Company

hirify.global develops semiconductor technologies and high-performance computing products.

What you will do

• Identify root-cause yield limiters across the technology-node lifecycle and develop corrective solutions.
• Perform statistical analysis and create visualizations for process-development roadmaps and yield milestones.
• Consolidate experimental and manufacturing data to understand defect modes and build yield models.
• Design measurement recipes and harden equipment and methodologies for advanced logic nodes.
• Collaborate with design, test, process-development, and factory teams to debug yield issues and support manufacturability.
• Execute new product introductions, design of experiments, and multiple concurrent projects.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Technology, or a related discipline.
• At least 2 years of experience in yield development, process technology, or a related field.
• Experience with statistical analysis and data-visualization tools.
• Bachelor’s degree with 4+ years of experience, Master’s degree with 3+ years, or PhD with 1+ years of experience.
• Strong problem-solving, communication, and cross-functional collaboration skills.
• Ability to work in the hybrid model at an assigned hirify.global site in Phoenix, Arizona, or Hillsboro, Oregon.

Nice to have

• Expertise in semiconductor process development, defect-density analysis, and data analytics.
• Experience with advanced semiconductor equipment, semiconductor factories, foundries, or failure analysis.
• Experience with brightfield, darkfield, and ebeam inspection.
• Experience in defect metrology and machine-learning applications for defect detection and yield modeling.

Culture & Benefits

• Collaborative work across interdisciplinary and cross-functional engineering teams.
• Competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Hybrid work model combining on-site and off-site work.