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5 часов назад

Module Engineer On-Shift (MEOS) – Night Shift (4) (Semiconductor Packaging)

85 200 - 139 810$
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Module Engineer On-Shift (MEOS) – Night Shift (4) (Semiconductor Packaging): Providing real-time factory-floor support for 24x7 semiconductor packaging manufacturing with an accent on equipment and process troubleshooting, lot movement, and shift communication. Focus on recovering process errors, managing lot disposition, enabling new tools, documenting specifications and RFCs, and collecting inspection and imaging data.

Location: On-site in Phoenix, Arizona, United States. Night Shift 4 runs from 6:00 PM to 6:00 AM on alternating 3- and 4-day work weeks, including Sundays through Tuesdays and alternating Saturdays.

Annual salary: $85,200–$139,810 USD.

Company

hirify.global develops semiconductor technologies and advanced substrate packaging solutions through its Substrate Packaging Technology Development organization.

What you will do

  • Provide hands-on, real-time support for equipment, process, and product issues on the factory floor.
  • Maintain continuous 24x7 lot movement through the semiconductor packaging manufacturing line.
  • Receive and deliver detailed shift pass-downs and align priorities with management.
  • Troubleshoot process issues, perform error recovery, manage lot disposition, and support new tool enabling.
  • Write and update specifications and Requests for Change, and perform non-standard procedures, inspection, and panel imaging.
  • Communicate key issues to Tool and Lot Owners and perform additional duties within the assigned functional area.

Requirements

  • On-site work in Phoenix, Arizona, United States is required.
  • Bachelor's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline plus 1+ years of relevant industry experience, or a master's degree in one of these fields.
  • Strong problem-solving, communication, adaptability, initiative, and teamwork skills.
  • This position is not eligible for hirify.global immigration sponsorship.

Nice to have

  • 1+ years of experience applying Statistical Process Control methodologies in manufacturing.
  • Hands-on experience in semiconductor packaging or packaging substrate manufacturing.

Culture & Benefits

  • Collaborative engineering environment focused on semiconductor packaging innovation.
  • Competitive compensation with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Alternating shift schedule with more days off than a traditional five-day work week.

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