Module Engineering (PhD Intern) (Semiconductor Manufacturing)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $120,898–$120,902 USD

Company

hirify.global Foundry develops semiconductor manufacturing technologies and supports high-performance production processes for customers worldwide.

What you will do

• Develop and implement manufacturing processes for a semiconductor production module.
• Sustain and improve manufacturing equipment performance and operational reliability.
• Troubleshoot equipment issues and support qualification activities.
• Collaborate with engineering teams to optimize process control methodologies.
• Apply statistical analysis and experimental design to improve process reliability and throughput.
• Perform materials and device characterization using techniques such as SEM and TEM.

Requirements

• Currently pursuing a Ph.D. in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or another STEM-related field.
• Knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition.
• Familiarity with statistical data analysis and experimental design.
• Experience with materials and physical device characterization techniques such as SEM or TEM.
• Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

• Expertise in advanced semiconductor device structures, fabrication, and process integration.
• Proficiency with JMP, Python, MATLAB, or C++.
• Research experience in device fabrication, physical characterization, or materials testing.
• Knowledge of process control systems and semiconductor device physics.

Culture & Benefits

• Hands-on experience in semiconductor manufacturing and process optimization.
• Collaborative environment focused on innovation and continuous improvement.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.