Principal Process Engineer — Advanced Semiconductor Device Development

Location: Ulm, Germany; onsite at the LMS13 Office

Company

hirify.global develops large-scale data storage systems and manufacturing technologies supporting AI-driven data infrastructure, hyperscale data centers, cloud platforms, and enterprise systems.

What you will do

• Develop and optimize semiconductor wafer fabrication processes across multiple process modules.
• Drive process integration from incoming wafers through fully processed devices and support transfer into pilot manufacturing.
• Perform hands-on cleanroom work across lithography, dry and wet etch, dielectric deposition, implantation, metallization, and wafer handling.
• Develop substrate preparation, wafer thinning, bonding, backside processing, metrology, defect inspection, and process-control flows.
• Coordinate with external vendors and manufacturing partners supporting complex multi-site wafer flows.
• Run DOE learning cycles, root-cause investigations, yield analysis, process optimization, and cross-functional device-performance correlation.

Requirements

• BS, MS, or PhD in Materials Science, Physics, Electrical Engineering, Chemical Engineering, or a related field.
• At least 5 years of semiconductor process development experience.
• Strong hands-on cleanroom experience across multiple semiconductor processing modules.
• Understanding of lithography, etch, dielectric deposition, implantation, metallization, and process integration.
• Experience with process characterization, SPC, DOE, and failure analysis methodologies.
• Strong experimental problem-solving skills and the ability to collaborate across multidisciplinary engineering teams.

Nice to have

• Experience with compound semiconductors, advanced or non-standard process flows, wafer bonding, substrate removal, or heterogeneous integration.
• Experience building scalable process infrastructure in R&D environments.
• Familiarity with advanced metrology and defect characterization techniques.

Culture & Benefits

• Work with multidisciplinary R&D, device, characterization, packaging, and reliability teams.
• Collaborate with external vendors and manufacturing partners across complex wafer flows.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Accessibility support is available throughout the application and hiring process.