Senior Optomechanical Packaging Engineer

Location: Milpitas, California, United States. Onsite work in an office and laboratory environment; up to 10% travel required. Candidates must be eligible to work in the United States, and visa sponsorship is not available.

Salary: $101,675–$169,475 per year, plus eligibility for a discretionary annual bonus.

Company

hirify.global develops technologies and products for advanced photonics, optical communication, and precision manufacturing applications.

What you will do

• Design precision optomechanical assemblies for fiber optics, photodiodes, laser sources, optical receivers, and photonic integrated circuits.
• Develop packaging architectures that balance optical performance, mechanical and thermal stability, manufacturability, reliability, and cost.
• Lead active alignment processes and integrate piezo stages, nanopositioners, linear motors, servo systems, precision encoders, optical metrology, and machine vision feedback.
• Optimize system accuracy, repeatability, throughput, and robustness while supporting automated assembly and manufacturing systems.
• Define qualification plans covering thermal cycling, temperature and humidity, shock and vibration, life testing, and accelerated aging.
• Perform failure analysis, root-cause investigations, simulation correlation, and production documentation for product release.

Requirements

• BS, MS, or PhD in Mechanical Engineering, Optical Engineering, Physics, Mechatronics, or a related field.
• 8+ years of experience developing optomechanical or photonic products.
• Strong experience in precision optomechanical design, tolerance analysis, and mechanical design.
• Hands-on experience with active optical alignment, automated assembly systems, motion control, and precision positioning.
• Experience supporting products from concept through production release, with strong laboratory troubleshooting and debugging skills.
• Eligibility to work in the United States is required; visa sponsorship is not available.

Nice to have

• Experience packaging photodiodes, lasers, optical receivers, optical transceivers, or photonic integrated circuits.
• Experience with machine vision, robotic assembly, fiber-attach, epoxy, solder, eutectic, or laser-welding processes.
• Familiarity with Telcordia, MIL, or IEC reliability standards, statistical process control, and yield analysis.
• Experience working with external packaging houses and manufacturing partners.

Culture & Benefits

• Office and laboratory work environment with laboratory equipment handling up to 20 lbs.
• Medical, dental, and vision insurance.
• 401(k) with company match, life and disability insurance.
• 12 paid holidays, sick time, and 15 paid vacation days.
• Paid parental leave, adoption assistance, and tuition reimbursement.