Physical Design Intern (ASIC)

Location: Petah-Tikva, Israel; onsite role

Company

Semiconductor technology company developing data infrastructure solutions for enterprise, cloud, AI, carrier, automotive, 5G/6G, and networking applications.

What you will do

• Implement future routing devices in the switching department.
• Contribute to the physical design and methodology of next-generation processor and ASIC designs.
• Work with industry-standard tools on large and complex ASICs.
• Support designs based on leading-edge CMOS process technology.
• Collaborate on semiconductor solutions for server, networking, automotive, and 5G/6G applications.

Requirements

• 4th-year student in Electrical Engineering or Computer Science.
• Excellent interpersonal and communication skills.
• Ability to work independently, manage work effectively, and learn quickly.
• Innovative thinking and strong technical and analytical capabilities.

Nice to have

• Knowledge of logic design and verification.
• Programming experience with Verilog, VHDL, or TCL.
• Experience developing workflow and automation infrastructure.
• Experience with commercial electronic design automation vendors and tools.

Culture & Benefits

• Competitive compensation and benefits.
• Collaborative, transparent, and inclusive work environment.
• Resources and support for professional growth and development.
• Work on technology intended for large-scale data infrastructure and next-generation semiconductor systems.

Hiring process

• Interviews evaluate individual experience, thought process, and communication skills in real time.
• Use of AI tools, transcription apps, automated answer generators, or automated note-taking bots during interviews is prohibited.
• The position may require export-control eligibility and an export license review before employment.