Director of Analog and Mixed-Signal IC Design (AI Hardware)

Location: Austin, Texas; full-time onsite position

Salary: $260K–$300K per year, plus equity opportunities.

Company

hirify.global is an AI hardware startup developing silicon photonics and programmable metasurface technology for energy-efficient, high-performance AI inference.

What you will do

• Build, lead, and mentor a team of analog, mixed-signal, RF/mmWave, and layout engineers.
• Define architectures and specifications for ADCs, DACs, modulator drivers, TIAs, analog front ends, PLLs, clocking, SerDes, high-speed I/O, references, and regulators.
• Own silicon from specification and design through verification, tape-out, bring-up, characterization, qualification, and production release.
• Lead low-power analog, high-speed mixed-signal, millimeter-wave, and electronic-photonic interface development.
• Establish design methodologies covering PVT and Monte Carlo analysis, reliability, mismatch, noise, design reviews, manufacturability, and test.
• Drive silicon debug, root-cause analysis, yield improvement, and collaboration with photonics, digital, packaging, systems, firmware, foundry, OSAT, and product engineering teams.

Requirements

• 15+ years of analog, mixed-signal, and/or RF IC design experience, including 5+ years leading teams at manager or director level.
• Proven experience taking analog and mixed-signal products from concept through tape-out, validation, qualification, yield ramp, production test, and high-volume manufacturing.
• Deep hands-on expertise in low-power precision analog, high-speed mixed-signal design, data converters, PLLs, high-speed transceivers, and amplifiers.
• Experience with millimeter-wave or high-frequency RF design, EM simulation, modeling, and measurement.
• Knowledge of advanced CMOS, FinFET, and/or SiGe BiCMOS processes; proficiency with Cadence Virtuoso, Spectre, and EM tools such as EMX.
• Experience with foundries and OSATs, DFT, ATE test development, trimming, calibration, failure analysis, and production reliability.

Nice to have

• PhD in Electrical Engineering, Computer Engineering, Physics, or a related field.
• Experience designing electronics for integrated photonics or optical interconnects, including modulator drivers, TIAs, laser drivers, or co-packaged optics.
• Experience with electronic-photonic co-design, heterogeneous integration, 3D stacking, 112G/224G PAM4 SerDes, or mmWave wireless and radar products.
• Experience with ultra-low-power circuit techniques, advanced packaging, signal and power integrity, and chip-package-board co-simulation.
• Patents, publications, recognized technical contributions, or experience building design infrastructure in a startup.

Culture & Benefits

• Collaborative work at the intersection of photonics, AI, and advanced computing.
• 100% coverage of base health plan premiums for employees and dependents, plus HSA contributions.
• Unlimited paid time off.
• 401(k) matching and stock option opportunities.
• Dental, vision, life, hospital, critical illness, and accident insurance, with personalized benefit plan options.