saplean manufacturingcadroot cause analysisgd&tcontinuous improvementmanufacturing engineeringsemiconductor equipment
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Понятные задачи в ведущей компании по производству полупроводникового оборудования делают вакансию привлекательной, но поздняя смена и отсутствие зарплатного диапазона требуют учесть важные компромиссы.
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Поздняя сменаЗарплата не указанаПонятные задачиЛидер отрасли
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Build Manufacturing Engineer (Semiconductor Equipment): Supporting daily manufacturing operations and developing assembly methods, tooling, work instructions, and production procedures with an accent on root cause analysis, manufacturability, and continuous improvement. Focus on validating fixtures and assembly aids, supporting NPI and engineering transfers, and improving production readiness through CAD, GD&T, and Lean Manufacturing.
Location: Singapore, Singapore. Full-time onsite role with a 4:00 PM–1:30 AM shift; travel up to 10% of the time. Relocation is not eligible.
Company
hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor and advanced display manufacturing.
What you will do
Support daily manufacturing build operations and resolve production issues.
Develop and maintain manufacturing methods, SAP routings, work instructions, and operating procedures.
Perform root cause analysis and implement corrective actions for assembly and quality issues.
Support new product introduction, engineering changes, and product or design transfer activities.
Design and validate manufacturing jigs, fixtures, tooling, and assembly aids.
Collaborate with Manufacturing, Quality, Planning, Supply Chain, and Design Engineering teams to improve production readiness, quality, safety, and productivity.
Requirements
Bachelor’s degree in Mechanical, Manufacturing, Industrial, or a related Engineering discipline.
At least 3 years of experience in manufacturing, production, or assembly engineering.
Ability to read and interpret 2D engineering drawings, GD&T, BOMs, and 3D CAD models.
Hands-on experience with CAD software such as Creo, SolidWorks, AutoCAD, or equivalent.
Strong problem-solving, analytical, and communication skills.
Nice to have
Experience in semiconductor equipment manufacturing.
Experience applying DFx and Lean Manufacturing principles.
Culture & Benefits
Supportive work culture focused on learning, development, and career growth.
Health and wellbeing programs and employee support resources.
Regular travel of up to 10% of the time may be required.
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