Electro-optical Signal Integrity

Location: Adliswil, Switzerland; full-time position.

Company

hirify.global develops semiconductor solutions and silicon photonics-based optical engines and components for enterprise, cloud, AI, carrier, and data center infrastructure.

What you will do

• Define and simulate high-frequency electrical interfaces for next-generation optical engines, including 400G/lane CPO and beyond.
• Perform co-design across photonics, analog/ASIC design, and packaging teams to optimize performance, power efficiency, and signal integrity.
• Test, characterize, and qualify components and integrated systems.
• Develop and validate end-to-end link budgets, correlating electrical and optical simulations with measurements.
• Analyze measurement data, identify performance limitations, and drive design improvements.
• Perform root cause analysis of complex signal integrity issues across electrical and optical domains.

Requirements

• Currently enrolled in a Master’s or PhD program in Electrical Engineering, Photonics, Physics, or a related field, with an expected graduation date after the internship.
• Solid foundation in RF/microwave engineering, transmission lines, and signal integrity fundamentals, including S-parameters, impedance matching, loss, and crosstalk mechanisms.
• Coursework or research exposure to optical communications, silicon photonics, or electro-optical devices such as modulators, photodetectors, and lasers.
• Experience in one or more of the following, with research or coursework accepted: EM or circuit simulation using HFSS, CST, or ADS; RF PCB design; high-frequency or electro-optical measurements using VNA, oscilloscope, AWG, or BERT; Python or MATLAB for data analysis, instrument automation, or system/link simulation.
• Knowledge of high-speed link concepts, including PAM4 signaling, equalization with FFE, DFE, or CTLE, and metrics such as BER, SNR, and eye diagrams.
• Exposure to advanced packaging, including 2.5D/3D integration or co-packaged optics.
• Curiosity and initiative, ability to work independently on a well-scoped project, collaborative approach, clear written and verbal communication, and comfort with ambiguity in a fast-paced environment.
• Eligibility to access export-controlled technology or software may be required; applicants may be subject to an export license review process.

Culture & Benefits

• Competitive compensation and benefits.
• Flexible, open, international, collaborative, transparent, and inclusive work environment.
• Resources and support for professional growth and development.
• Work on silicon photonics, advanced packaging, and high-speed electronics for AI and data center infrastructure.

Hiring process

• Interviews evaluate individual experience, thought process, and communication skills in real time.
• AI tools, transcription applications, real-time answer generators, and automated note-taking tools are not permitted during interviews.