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5 дней назад

Sr Principal Process Development Engineer (SMT)

136 200 - 178 815$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr Principal Process Development Engineer (SMT): Owning and optimizing surface mount technology processes for probe card PCB manufacturing with an accent on solder paste application, reflow, placement, inspection, and process capability. Focus on troubleshooting SMT equipment, reducing assembly defects, improving yield and throughput, and leading Lean/6σ process improvements across engineering and production teams.

Location: Livermore, California, United States; regular day shift

Salary: $136,200–$178,815 per year

Company

hirify.global provides semiconductor test and measurement technologies supporting device characterization, reliability, design debugging, qualification, and production testing.

What you will do

  • Develop, qualify, maintain, and optimize SMT processes for high-density probe card PCBs.
  • Own solder paste selection and application, reflow profiling, placement parameters, recipes, and inspection processes.
  • Provide daily engineering support for stencil printers, pick-and-place machines, reflow ovens, and SPI systems.
  • Lead equipment troubleshooting, root cause analysis, preventive maintenance planning, calibration, and spare-parts strategies.
  • Analyze yield, defect Pareto charts, and SPC trends while driving corrective actions for soldering and assembly defects.
  • Support prototype builds, new product introductions, production deviations, operator training, documentation, and Lean/6σ improvement projects.

Requirements

  • Bachelor’s degree in electrical, mechanical, manufacturing engineering, materials science, or a related field, with at least 8 years of related experience; alternatively, 6 years with a master’s degree, 3 years with a PhD, or equivalent experience.
  • 3–7 years of SMT or PCB assembly experience, with semiconductor, PCBA, or electronics assembly experience preferred.
  • Strong knowledge of solder paste behavior, reflow principles, component placement, defect mechanisms, and high-density or fine-pitch assembly.
  • Hands-on experience with SMT equipment and inspection systems, including SPI and AOI.
  • Experience with SPC, FMEA, DOE, structured root cause analysis, CAM/EDA data, and stencil or paste-aperture optimization.
  • Ability to work cross-functionally with plating, photolithography, mechanical assembly, electrical test, supply chain, quality, and production teams.

Nice to have

  • Experience with probe cards, semiconductor test hardware, or high-precision PCB manufacturing.
  • Lean/6σ Green Belt or Black Belt certification.
  • Experience with MES systems and factory automation.

Culture & Benefits

  • Day-shift schedule in an in-person manufacturing environment.
  • Medical, dental, vision, life, and disability insurance.
  • 401(k) with company match, employee stock purchase plan, paid time off, and flexible spending or savings accounts.
  • Quarterly profit-sharing bonuses.
  • Work environment centered on customer focus, ownership, respectful communication, and continuous improvement.

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