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2 дня назад

Mechanical Design Engineer - Engineer-To-Order, Motion Systems (PSP) (Semiconductor Equipment)

93 000 - 135 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Mechanical Design Engineer - Engineer-To-Order, Motion Systems (PSP) (Semiconductor Equipment): Designing and developing complex wet processing chambers, subassemblies, and components for semiconductor manufacturing equipment with an accent on motion systems, automation, gas and fluid delivery, and process chamber configuration. Focus on analytical studies, structural and thermal analysis, prototype testing, design documentation, and hands-on collaboration with manufacturing and customers.

Location: Horsham, Pennsylvania, United States; travel up to 10% to customer sites and supplier facilities.

Salary: $93,000–$135,000 per year, plus bonus opportunity.

Company

hirify.global designs, manufactures, and services advanced equipment used to produce semiconductors, LEDs, displays, photonics, MEMS, and other digital technologies.

What you will do

  • Design and configure wet processing chambers for engineered-to-order single-wafer processing tools.
  • Develop subassemblies and components for aggressive wet processing environments.
  • Perform vessel, heat transfer, structural, fluid, static, dynamic, and motion-system analyses.
  • Define mechanical specifications, support design reviews, and present concepts and test results to customers and internal stakeholders.
  • Develop test plans, prototypes, and experiments while supporting manufacturing, procurement, and troubleshooting.
  • Create and release engineering documentation through the ECO process and support product lifecycle phase gates.

Requirements

  • BS in Mechanical Engineering with at least 5 years of relevant experience, or MS in Mechanical Engineering with at least 3 years of experience; an MS is preferred.
  • Required experience with SolidWorks and AutoCAD or similar 3D CAD systems.
  • Experience with structural and thermal finite element analysis.
  • Experience with SAP or a similar PLM system.
  • Ability to lead projects, collaborate across mechanical, electrical, software, manufacturing, supplier, and customer teams, and make technical presentations.
  • Hands-on experience with devices, prototyping, testing, and troubleshooting; proficiency with Microsoft Office.

Nice to have

  • Knowledge of industrial controls, sensors, automation, robotics, instrumentation, motion control, motor selection, encoders, electronic packaging, and SEMI standards.
  • Project management experience.

Culture & Benefits

  • Multidisciplinary engineering environment with hands-on collaboration across engineering and manufacturing.
  • Medical, dental, and vision insurance.
  • 401(k) with company match, employee stock purchase plan, and flexible spending accounts.
  • Holiday, vacation, and sick time, plus commuter benefits.
  • Life, accident, disability, emergency travel, tuition reimbursement, and employee assistance benefits.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be conducted before an offer.

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