Staff Engineer EOL Assembly Process (Semiconductors)

Location: Krubong, Melaka, Malaysia; onsite process engineering role

Company

hirify.global manufactures discrete semiconductors and passive electronic components for automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets.

What you will do

• Manage end-of-line assembly process engineering for hirify.global assembly production at subcontractor facilities.
• Drive improvement projects focused on quality, yield, hold lot rate, and disposition cycle time.
• Support package transfers and new package introductions.
• Set up, qualify, and implement assembly processes, parameters, and procedures.
• Establish baseline specifications and procedures, define statistical test methods, and reduce quality defects.
• Coordinate engineering evaluations, review corrective actions, and support customer complaint verification and prevention activities.

Requirements

• 5–10 years of assembly process engineering experience.
• Hands-on experience with power discrete and/or power management packages; package assembly with Cu Clip is highly preferred.
• Bachelor’s or master’s degree in electronics or electrical engineering.
• Proficiency in English, along with problem-solving, communication, and presentation skills.
• Ability to work efficiently under pressure and travel overseas when requested.

Culture & Benefits

• Health care coverage and financial support programs.
• Career paths and opportunities to work globally and locally.
• Open and collaborative work culture.
• Stable business environment and sports and recreation activities.