Lead Engineer, Fab Technology (CMP)

Location: Hsinchu City, Taiwan

Company

hirify.global develops materials and process solutions for semiconductor manufacturing.

What you will do

• Develop and transfer CMP solutions to address customer needs and support product adoption.
• Interpret Voice of the Customer and Critical-to-Quality requirements to define technical problems.
• Build customer relationships and act as a primary technical liaison between customers and internal teams.
• Collaborate with Product Line Managers, Sales Account Managers, R&D, and Material Solutions Engineers.
• Lead Technical Exchange Meetings and present technical solutions to customers.
• Drive customer qualification, implementation, and adoption activities to completion.

Requirements

• Master’s degree in Chemistry, Materials Science, Chemical Engineering, or a related technical discipline.
• At least five years of experience in CMP-related processes and/or semiconductor device manufacturing.
• Demonstrated expertise in CMP applications and strong knowledge of CMP consumables, including slurries, pads, conditioning disks, and pCMP materials.
• Understanding of semiconductor device structures, process integration schemes, customer integration processes, and application requirements.
• Strong critical-thinking, systematic problem-solving, communication, collaboration, and project ownership skills.
• Ability to work independently, adapt to changing priorities, and manage multiple tasks.

Nice to have

• Advanced degree in a relevant technical discipline.
• Experience in semiconductor fabrication and process integration.

Culture & Benefits

• Cross-functional collaboration with customers, Sales, Product Line Management, R&D, and Material Solutions teams.
• Hands-on work focused on technical problem-solving and customer outcomes.
• Opportunities to contribute to continuous learning and professional development.