Head of Device Fabrication, Advanced Packaging and Assembly (Quantum Computing)

Location: Singapore; remote workplace

Company

hirify.global develops the next generation of quantum computers for applications across healthcare, aerospace, materials science, and other industries.

What you will do

• Define and deliver the technology roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.
• Build, lead, and develop a multidisciplinary technical organisation across Singapore and Japan.
• Lead foundry process development from early concepts through production, including advanced packaging, bonding, assembly, interconnect, and test solutions.
• Own R&D programmes, qualification activities, yield improvement, manufacturing readiness, and supplier transfers.
• Manage strategic relationships with semiconductor foundries, OSATs, suppliers, and external manufacturing partners.
• Coordinate engineering, design, product, systems, and architecture teams to deliver manufacturable solutions within agreed scope, quality, budget, and timelines.

Requirements

• Degree or equivalent experience in semiconductor engineering, materials science, physics, microelectronics, mechanical engineering, chemical engineering, or a related technical discipline.
• Demonstrated success leading multidisciplinary teams of senior engineers, specialists, and managers.
• Significant experience in semiconductor process development, advanced packaging, assembly, or device industrialisation within a foundry, IDM, OSAT, deep-tech, or similar environment.
• Experience taking technologies from concept through qualification, yield improvement, supplier transfer, and production readiness.
• Technical expertise in areas such as microfabrication, wafer processing, lithography, deposition, etch, wafer bonding, die attach, interconnects, packaging, metrology, reliability, or failure analysis.
• Experience managing foundries, OSATs, suppliers, and external manufacturing partners in complex, multi-site, or international environments.

Nice to have

• Experience leading teams or supplier networks across Singapore, Japan, or the wider Asia-Pacific semiconductor ecosystem.
• Experience with quantum processors, trapped-ion devices, MEMS, photonics, compound semiconductors, heterogeneous integration, or other complex device platforms.
• Understanding of technical contracts, intellectual property protection, quality systems, supply chain risk, cost control, and development governance.

Culture & Benefits

• Work on quantum computing technology intended to address difficult problems across multiple industries.
• Join a rapidly growing environment with opportunities to shape products and organisational development.
• Collaborate with scientists and engineers on complex technical challenges.
• Access an inclusive workplace committed to diversity, transparency, and continuous improvement.
• Develop expertise and career scope while contributing to high-impact engineering programmes.