pythonnetworkingelectronics packagingthermal designthermal testingflothermheatsink designcf d simulation
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата не указанаАктуальные инструментыПонятная зона ответственностиКрупный технологический бизнес
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Текст:
Hirify AI/Оригинал
TL;DR
Senior Thermal/Hardware Engineer (thermal design/electronics packaging): Designing and validating thermal systems for high-density, high-power networking platforms with an accent on CFD simulation, heatsink development, thermal testing, and system-level architecture. Focus on leading end-to-end thermal development, correlating simulations with lab measurements, solving complex design tradeoffs, and mentoring engineers through production.
Location: Onsite at an HPE office in Singapore, Central Singapore.
Company
hirify.global is a global edge-to-cloud company developing solutions that connect, protect, analyze, and act on data and applications from edge to cloud.
What you will do
Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms from concept through mass production.
Own the thermal development lifecycle, including heatsink design, CFD simulation, thermal mockups, laboratory testing, and data analysis.
Design and validate thermal solutions for electronics enclosures, chassis, and line cards.
Define and execute validation plans covering thermal margins, acoustics, shock and vibration, reliability, and safety.
Drive system-level tradeoffs with mechanical, electrical, power, firmware, and software engineering teams, while coordinating vendors, suppliers, and manufacturing partners.
Lead root-cause analysis, corrective actions, architecture decisions, risk management, issue resolution, and technical mentoring across complex development programs.
Requirements
Bachelor’s or Master’s degree in Mechanical Engineering or a related field.
10+ years of experience in thermal design and electronics packaging.
Demonstrated experience leading thermal development on networking platforms.
Deep expertise in thermal design and electronics packaging for high-density, high-power data center and networking systems.
Strong proficiency with CFD simulation tools, specifically FloTHERM, including correlating simulation models with laboratory measurements.
Solid understanding of system thermal control, fan selection, and fan control methodologies.
Hands-on experience with thermocouples, DAQs, environmental and thermal chambers, and metered airflow and pressure benches.
Ability to develop test automation and data analysis scripts using Python or equivalent scripting languages.
Proficiency designing heatsinks, sheet metal structures, plastic components, ducts, and baffles, with working knowledge of manufacturing processes and production tooling.
Experience working with vendors and contract manufacturers on design-for-manufacturability and cost optimization.
Proven technical leadership, including independently driving complex multidisciplinary projects, managing competing priorities, and making system-level tradeoffs.
Ability to drive design innovation, improve engineering standards, and clearly present thermal strategies and design proposals to engineering peers and senior leadership.
Culture & Benefits
Onsite work from an HPE office with flexibility to manage work and personal needs.
Benefits supporting physical, financial, and emotional health and wellbeing.
Personal and professional development programs supporting career growth and movement across divisions.
Inclusive workplace that values varied backgrounds and individual uniqueness.
Opportunity to collaborate with engineers, technicians, external design partners, managers, directors, and program core teams across multiple projects.
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