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обновлено 10 дней назад

Senior Thermal/Hardware Engineer

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Senior Thermal/Hardware Engineer (thermal design/electronics packaging): Designing and validating thermal systems for high-density, high-power networking platforms with an accent on CFD simulation, heatsink development, thermal testing, and system-level architecture. Focus on leading end-to-end thermal development, correlating simulations with lab measurements, solving complex design tradeoffs, and mentoring engineers through production.

Location: Onsite at an HPE office in Singapore, Central Singapore.

Company

hirify.global is a global edge-to-cloud company developing solutions that connect, protect, analyze, and act on data and applications from edge to cloud.

What you will do

  • Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms from concept through mass production.
  • Own the thermal development lifecycle, including heatsink design, CFD simulation, thermal mockups, laboratory testing, and data analysis.
  • Design and validate thermal solutions for electronics enclosures, chassis, and line cards.
  • Define and execute validation plans covering thermal margins, acoustics, shock and vibration, reliability, and safety.
  • Drive system-level tradeoffs with mechanical, electrical, power, firmware, and software engineering teams, while coordinating vendors, suppliers, and manufacturing partners.
  • Lead root-cause analysis, corrective actions, architecture decisions, risk management, issue resolution, and technical mentoring across complex development programs.

Requirements

  • Bachelor’s or Master’s degree in Mechanical Engineering or a related field.
  • 10+ years of experience in thermal design and electronics packaging.
  • Demonstrated experience leading thermal development on networking platforms.
  • Deep expertise in thermal design and electronics packaging for high-density, high-power data center and networking systems.
  • Strong proficiency with CFD simulation tools, specifically FloTHERM, including correlating simulation models with laboratory measurements.
  • Solid understanding of system thermal control, fan selection, and fan control methodologies.
  • Hands-on experience with thermocouples, DAQs, environmental and thermal chambers, and metered airflow and pressure benches.
  • Ability to develop test automation and data analysis scripts using Python or equivalent scripting languages.
  • Proficiency designing heatsinks, sheet metal structures, plastic components, ducts, and baffles, with working knowledge of manufacturing processes and production tooling.
  • Experience working with vendors and contract manufacturers on design-for-manufacturability and cost optimization.
  • Proven technical leadership, including independently driving complex multidisciplinary projects, managing competing priorities, and making system-level tradeoffs.
  • Ability to drive design innovation, improve engineering standards, and clearly present thermal strategies and design proposals to engineering peers and senior leadership.

Culture & Benefits

  • Onsite work from an HPE office with flexibility to manage work and personal needs.
  • Benefits supporting physical, financial, and emotional health and wellbeing.
  • Personal and professional development programs supporting career growth and movement across divisions.
  • Inclusive workplace that values varied backgrounds and individual uniqueness.
  • Opportunity to collaborate with engineers, technicians, external design partners, managers, directors, and program core teams across multiple projects.

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