Назад
Company hidden
6 дней назад

Senior Advanced Packaging Defect Inspection Engineer (Semiconductor Metrology)

115 110 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Senior Advanced Packaging Defect Inspection Engineer (Semiconductor Metrology): Developing and qualifying advanced metrology and inspection processes and equipment for semiconductor packaging programs with an accent on process integration, equipment readiness, and technology roadmapping. Focus on end-to-end tool qualification, fab problem solving, inline feedback, and intelligent excursion detection with AI, machine learning, and advanced process control teams.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $115,110–$219,550 USD

Company

hirify.global develops semiconductor technologies and advanced packaging solutions for high-volume manufacturing and future technology nodes.

What you will do

  • Develop and enable metrology and inspection processes for advanced packaging, new product architectures, and future technology nodes.
  • Define the long-range metrology technology roadmap based on industry trends, emerging measurement technologies, and program requirements.
  • Qualify next-generation metrology equipment from installation and acceptance testing through process validation and fab readiness.
  • Lead module development from first wafer through process sign-off, including recipe development, specifications, SPC strategy, and sampling plans.
  • Provide fab support by resolving process excursions, metrology-related holds, and equipment performance issues.
  • Collaborate with equipment suppliers, AI, machine learning, and advanced process control teams on tool capabilities, predictive monitoring, and excursion detection.

Requirements

  • Bachelor’s degree in a relevant STEM field with 4+ years of relevant experience, or a master’s degree with 2+ years of relevant experience, or a PhD in a relevant field.
  • Experience with semiconductor processing, wafer-level assembly, or cleanroom environments.
  • Proficiency in process development, statistical process control, and manufacturing process improvement.
  • Technical experience in module engineering or fab process and hardware technology development.
  • Ability to collaborate with cross-functional teams and communicate technical risks and readiness to senior program leadership.

Nice to have

  • PhD with 3+ years of relevant experience.
  • Experience with metrology fundamentals, packaging processes, equipment automation, or project management.
  • Experience using Python, dashboard creation, and scripting for data analysis and process optimization.
  • Experience engaging metrology equipment vendors at a technical roadmap and co-development level.

Culture & Benefits

  • Full-time experienced-hire position with Shift 1 scheduling.
  • Competitive pay with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Cross-functional work across process integration, module engineering, yield, operations, automation, and senior program leadership.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →