6 дней назад
Senior Advanced Packaging Defect Inspection Engineer (Semiconductor Metrology)
115 110 - 219 550$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Advanced Packaging Defect Inspection Engineer (Semiconductor Metrology): Developing and qualifying advanced metrology and inspection processes and equipment for semiconductor packaging programs with an accent on process integration, equipment readiness, and technology roadmapping. Focus on end-to-end tool qualification, fab problem solving, inline feedback, and intelligent excursion detection with AI, machine learning, and advanced process control teams.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $115,110–$219,550 USD
Company
develops semiconductor technologies and advanced packaging solutions for high-volume manufacturing and future technology nodes.
What you will do
- Develop and enable metrology and inspection processes for advanced packaging, new product architectures, and future technology nodes.
- Define the long-range metrology technology roadmap based on industry trends, emerging measurement technologies, and program requirements.
- Qualify next-generation metrology equipment from installation and acceptance testing through process validation and fab readiness.
- Lead module development from first wafer through process sign-off, including recipe development, specifications, SPC strategy, and sampling plans.
- Provide fab support by resolving process excursions, metrology-related holds, and equipment performance issues.
- Collaborate with equipment suppliers, AI, machine learning, and advanced process control teams on tool capabilities, predictive monitoring, and excursion detection.
Requirements
- Bachelor’s degree in a relevant STEM field with 4+ years of relevant experience, or a master’s degree with 2+ years of relevant experience, or a PhD in a relevant field.
- Experience with semiconductor processing, wafer-level assembly, or cleanroom environments.
- Proficiency in process development, statistical process control, and manufacturing process improvement.
- Technical experience in module engineering or fab process and hardware technology development.
- Ability to collaborate with cross-functional teams and communicate technical risks and readiness to senior program leadership.
Nice to have
- PhD with 3+ years of relevant experience.
- Experience with metrology fundamentals, packaging processes, equipment automation, or project management.
- Experience using Python, dashboard creation, and scripting for data analysis and process optimization.
- Experience engaging metrology equipment vendors at a technical roadmap and co-development level.
Culture & Benefits
- Full-time experienced-hire position with Shift 1 scheduling.
- Competitive pay with stock bonuses.
- Health, retirement, and vacation benefits.
- Cross-functional work across process integration, module engineering, yield, operations, automation, and senior program leadership.
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