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6 дней назад

Senior Front-End Design Engineer (AI Chips)

200 000 - 290 000$
Формат работы
remote (только USA)/hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Senior Front-End Design Engineer (AI Chips) (RTL/ASIC): Designing and integrating high-performance, power-efficient RTL for Cerebras Wafer Scale Engines with an accent on chip micro-architecture, third-party IP integration, and PPA closure. Focus on building complex semiconductor designs, solving silicon-level functional, timing, and power issues, and coordinating verification, physical design, software, and system integration.

Location: Sunnyvale, California, with a hybrid work environment and remote option

Salary: $200,000–$290,000 annually, plus potential bonus and equity

Company

hirify.global builds wafer-scale AI processors and high-speed computing systems for model labs, enterprises, and AI-native startups.

What you will do

  • Drive chip design from functional specification and micro-architecture through RTL development and synthesis.
  • Integrate front-end chip designs and third-party IP for hirify.global Wafer Scale Engines.
  • Work with physical design teams to achieve power, performance, and area goals.
  • Collaborate with verification and DFT teams to improve functional and test coverage.
  • Partner with software and system teams to optimize product performance and features.
  • Debug silicon-level functional, timing, and power issues during bring-up.

Requirements

  • 8+ years of experience delivering complex, high-performance RTL designs.
  • Master’s degree in Computer Science, Electrical Engineering, or an equivalent field.
  • Multiple successful silicon deliveries and experience with front-end chip integration.
  • Experience in high-performance computing, GPU or CPU design, machine learning, or related fields.
  • Experience with TCP/IP, RDMA, Ethernet, PCIe, CPU interfaces, and SerDes technology.
  • Working knowledge of Python and TCL scripting tools, plus the ability to work in a hybrid environment.

Nice to have

  • Experience with FPGA development tools, place and route, floor planning, and timing analysis.
  • Experience managing external ASIC vendors through the product development cycle.

Culture & Benefits

  • Work on a wafer-scale AI platform designed to go beyond GPU limitations.
  • Opportunity to contribute to and publish cutting-edge AI research.
  • Work with one of the fastest AI supercomputers in the world.
  • Startup vitality combined with job stability.
  • Non-corporate culture focused on individual perspectives, learning, growth, and inclusion.

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