7 дней назад
Product Engineering Architect (3D IC)
185 500 - 344 500$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Product Engineering Architect (3D IC) (3D IC, heterogeneous integration, advanced packaging): Defining and delivering physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging with an accent on product strategy, customer deployment, and cross-functional technical leadership. Focus on shaping complex design methodologies, validating solutions with strategic customers, and driving next-generation semiconductor capabilities from requirements through deployment.
Location: San Jose, California, United States; approximately 5–10% travel for strategic customer engagements and internal collaboration
Annual salary: $185,500–$344,500, plus potential bonus, equity, and benefits
Company
A technology company developing electronic design automation solutions and semiconductor design technologies.
What you will do
- Define, validate, and promote end-to-end physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging.
- Lead strategic customer engagements and guide the definition and deployment of multi-die co-design methodologies.
- Shape the product roadmap using customer requirements, market trends, competitive insights, and technical feasibility.
- Create product requirement specifications, technical use cases, demonstrations, application workflows, and enablement materials.
- Provide technical leadership on solution validation, trade-off analysis, adoption risks, bugs, and enhancements.
- Collaborate with R&D, Product Management, Field teams, Technical Publications, and Product Validation from product definition through customer deployment.
Requirements
- Bachelor’s degree in Electrical Engineering, Electronics, or a related technical field.
- 15+ years of experience in product engineering, methodology development, customer enablement, or technical leadership.
- Deep expertise in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.
- Strong hands-on knowledge of the Virtuoso platform and custom IC design flows.
- Experience working with strategic customers, discovering complex requirements, communicating with executives, and deploying advanced design flows.
- Ability to lead through influence, mentor technical contributors, prioritize effectively, and collaborate across global and multicultural teams.
Nice to have
- Experience with 3D IC co-design, heterogeneous integration, and silicon-package-board integration.
- Knowledge of Allegro Package Designer Plus and package implementation methodologies.
- Knowledge of Virtuoso SKILL or another interpreted language.
Culture & Benefits
- Paid vacation and paid holidays.
- 401(k) plan with employer match.
- Employee stock purchase plan.
- Medical, dental, and vision plan options.
- Equal employment opportunity and a focus on diversity and inclusion.
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