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7 дней назад

Product Engineering Architect (3D IC)

185 500 - 344 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
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TL;DR
Product Engineering Architect (3D IC) (3D IC, heterogeneous integration, advanced packaging): Defining and delivering physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging with an accent on product strategy, customer deployment, and cross-functional technical leadership. Focus on shaping complex design methodologies, validating solutions with strategic customers, and driving next-generation semiconductor capabilities from requirements through deployment.

Location: San Jose, California, United States; approximately 5–10% travel for strategic customer engagements and internal collaboration

Annual salary: $185,500–$344,500, plus potential bonus, equity, and benefits

Company

A technology company developing electronic design automation solutions and semiconductor design technologies.

What you will do

  • Define, validate, and promote end-to-end physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging.
  • Lead strategic customer engagements and guide the definition and deployment of multi-die co-design methodologies.
  • Shape the product roadmap using customer requirements, market trends, competitive insights, and technical feasibility.
  • Create product requirement specifications, technical use cases, demonstrations, application workflows, and enablement materials.
  • Provide technical leadership on solution validation, trade-off analysis, adoption risks, bugs, and enhancements.
  • Collaborate with R&D, Product Management, Field teams, Technical Publications, and Product Validation from product definition through customer deployment.

Requirements

  • Bachelor’s degree in Electrical Engineering, Electronics, or a related technical field.
  • 15+ years of experience in product engineering, methodology development, customer enablement, or technical leadership.
  • Deep expertise in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.
  • Strong hands-on knowledge of the Virtuoso platform and custom IC design flows.
  • Experience working with strategic customers, discovering complex requirements, communicating with executives, and deploying advanced design flows.
  • Ability to lead through influence, mentor technical contributors, prioritize effectively, and collaborate across global and multicultural teams.

Nice to have

  • Experience with 3D IC co-design, heterogeneous integration, and silicon-package-board integration.
  • Knowledge of Allegro Package Designer Plus and package implementation methodologies.
  • Knowledge of Virtuoso SKILL or another interpreted language.

Culture & Benefits

  • Paid vacation and paid holidays.
  • 401(k) plan with employer match.
  • Employee stock purchase plan.
  • Medical, dental, and vision plan options.
  • Equal employment opportunity and a focus on diversity and inclusion.

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