3 дня назад
Sustaining Engineer (Semiconductor Manufacturing)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Sustaining Engineer (Semiconductor Manufacturing): Coordinating semiconductor production planning, WIP movement, OSAT capacity, packaging and test activities across a global manufacturing network with an accent on supply chain execution, production delivery, and supplier management. Focus on resolving production issues, supporting manufacturing ramps and new product introduction, and analyzing cycle-time, inventory, and capacity data.
Location: Porto, Portugal. Workplace: On-site
Company
develops semiconductor products supported by a global technology and manufacturing operations network.
What you will do
- Monitor OSAT forecasts, work-in-progress movement, raw material inventories, cycle times, and product delivery.
- Coordinate production pull-ins and secure OSAT capacity against customer demand and upside requirements.
- Work with OSAT suppliers on production ramps, delivery issues, quality audits, and quarterly performance reviews, including on-site travel.
- Manage engineering WIP and coordinate packaging and test manufacturing steps with silicon technology and yield enhancement teams.
- Support Foundry RMA execution and new product introduction activities involving WIP movement and delivery.
- Build supplier relationships and initiate executive-level discussions to resolve operational issues.
Requirements
- Bachelor’s degree in technology, supply chain, or business is preferred.
- Experience with semiconductor manufacturing planning and key planning concepts in a semiconductor company.
- Strong data analysis skills and the ability to manage multiple projects and deadlines.
- Strong communication skills in English.
- High ethical standards and a consistent, fair approach to supplier management.
- Ability to work effectively as part of a team and take ownership of deliverables.
Nice to have
- Familiarity with SAP for WIP inventory management, hold lot management, and purchase requisitions.
- Expertise in IC package assembly processes, packaging trends, and customer requirements.
- Experience with WLCSP or related bumping technology assembly.
- Knowledge of JMP, AutoCAD, Gerber/PCB design, material science, process interactions, or assembly tool design and fabrication.
- Advanced degree in an engineering field.
Culture & Benefits
- Work within a global manufacturing network involving suppliers, engineering teams, and supply chain partners.
- Collaborate across semiconductor operations, packaging, test, quality, and yield enhancement functions.
- Perform on-site supplier visits and support production ramps and operational improvements.
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