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3 дня назад

Sustaining Engineer (Semiconductor Manufacturing)

Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
Portugal
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sustaining Engineer (Semiconductor Manufacturing): Coordinating semiconductor production planning, WIP movement, OSAT capacity, packaging and test activities across a global manufacturing network with an accent on supply chain execution, production delivery, and supplier management. Focus on resolving production issues, supporting manufacturing ramps and new product introduction, and analyzing cycle-time, inventory, and capacity data.

Location: Porto, Portugal. Workplace: On-site

Company

hirify.global develops semiconductor products supported by a global technology and manufacturing operations network.

What you will do

  • Monitor OSAT forecasts, work-in-progress movement, raw material inventories, cycle times, and product delivery.
  • Coordinate production pull-ins and secure OSAT capacity against customer demand and upside requirements.
  • Work with OSAT suppliers on production ramps, delivery issues, quality audits, and quarterly performance reviews, including on-site travel.
  • Manage engineering WIP and coordinate packaging and test manufacturing steps with silicon technology and yield enhancement teams.
  • Support Foundry RMA execution and new product introduction activities involving WIP movement and delivery.
  • Build supplier relationships and initiate executive-level discussions to resolve operational issues.

Requirements

  • Bachelor’s degree in technology, supply chain, or business is preferred.
  • Experience with semiconductor manufacturing planning and key planning concepts in a semiconductor company.
  • Strong data analysis skills and the ability to manage multiple projects and deadlines.
  • Strong communication skills in English.
  • High ethical standards and a consistent, fair approach to supplier management.
  • Ability to work effectively as part of a team and take ownership of deliverables.

Nice to have

  • Familiarity with SAP for WIP inventory management, hold lot management, and purchase requisitions.
  • Expertise in IC package assembly processes, packaging trends, and customer requirements.
  • Experience with WLCSP or related bumping technology assembly.
  • Knowledge of JMP, AutoCAD, Gerber/PCB design, material science, process interactions, or assembly tool design and fabrication.
  • Advanced degree in an engineering field.

Culture & Benefits

  • Work within a global manufacturing network involving suppliers, engineering teams, and supply chain partners.
  • Collaborate across semiconductor operations, packaging, test, quality, and yield enhancement functions.
  • Perform on-site supplier visits and support production ramps and operational improvements.

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