Senior Mechanical Engineer (AI Infrastructure)

Location: Taipei City, Taiwan, with occasional travel to Hsinchu

Company

Hardware startup developing silicon, packaging, software, and systems solutions to improve AI data center performance, GPU utilization, reliability, and operating costs.

What you will do

• Design mechanical systems for rack-mounted computing hardware, including sheet-metal chassis, structural frames, mounting assemblies, card cages, PSU structures, and cable management.
• Develop board-level mounting structures for high-speed electronics and integrate cold plates, manifolds, airflow ducting, and flow-management hardware.
• Drive Design for Manufacturability and Design for Assembly throughout the design cycle, producing manufacturing-ready CAD models and drawings.
• Review and approve ODM-generated 3D CAD models, 2D drawings, and tolerance stackup analyses.
• Evaluate BOM, tooling, assembly, and component costs while identifying cost-reduction opportunities.
• Support prototype builds, EVT/DVT validation, production ramp, and program milestone tracking.

Requirements

• Bachelor's degree in Mechanical Engineering or a related field.
• 10 years of experience designing mechanical systems for electronics hardware.
• Hands-on experience designing chassis for server or networking rack-mounted systems.
• Experience delivering designs through ODM partners and supporting manufacturing.
• Experience with DFM and DFA.
• Proficiency with 3D CAD tools such as SolidWorks, Creo, or NX, plus strong communication skills for cross-functional hardware work.

Culture & Benefits

• Work with an experienced engineering team spanning silicon, packaging, optics, software, and systems.
• Contribute to AI infrastructure technology validated by leading hyperscalers.
• Work with best-in-class supply chain and ODM partners.
• Base compensation is determined according to skills, experience, qualifications, work location, market trends, and comparable employee compensation.