Customer Engineer – ESMC Long-Term Assignment (Semiconductor)

Location: Hsinchu, Kaohsiung, Linkou, Taichung, or Tainan, Taiwan; long-term assignment in Dresden, Germany starting December 2027. Onsite field service work with weekend, shift, travel, and on-call requirements.

Company

hirify.global develops and services materials engineering equipment used in semiconductor chips and advanced displays.

What you will do

• Install, maintain, upgrade, test, and diagnose TSMC F24 semiconductor equipment.
• Perform preventive and corrective maintenance across electrical, vacuum, mechanical, plasma, hydraulic, and gas systems.
• Troubleshoot hardware issues, resolve FDC mismatches, order replacement parts, and manage service cases and escalations.
• Follow safety, environmental, PIP, 6S, task-plan, and cleanroom procedures.
• Coordinate with customers, Germany-based customer engineering teams, local PSE teams, technicians, leads, and field service operations.
• Support parts management, deinstall activities, on-call rotations, and coaching for junior engineers and international colleagues.

Requirements

• Bachelor’s or Master’s degree in Engineering; hardware-related education is preferred.
• Ability to read electrical and mechanical schematics and use hand tools and digital multimeters.
• Basic mechanical aptitude in pneumatics, hydraulics, electronics, vacuum, or thermodynamics.
• Strong written and verbal communication skills and proficiency with Microsoft Office.
• TOEIC score of 550 or higher.
• Ability to work in cleanrooms with full protective gear, lift 10–20 kg, work shifts and weekends, and support up to 60 hours per week or 12 hours per day.

Nice to have

• Two or more years of TSMC fab experience.

Culture & Benefits

• Supportive environment focused on learning, development, and continuous improvement.
• Collaborative “Team In and Team Out” culture built on accountability, mutual respect, and teamwork.
• Health and wellbeing programs supporting personal and professional growth.
• Flexible scheduling with field travel required for approximately 50% of the time.