4 дня назад
Recording Head Mechanical Process Development - Engineer II (Onsite)
76 800 - 109 900$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Recording Head Mechanical Process Development - Engineer II (Precision Lapping): Developing row bar lapping processes and equipment for recording heads with an accent on sub-nanometer dimensional control, angstrom-level surface finishes, and production capability. Focus on root-cause analysis, experimentation, equipment integration, process validation, and transferring qualified solutions to volume manufacturing in Thailand.
Location: Bloomington, Minnesota, United States; onsite Monday–Friday during core business hours. Travel up to 10%.
Salary: $76,800–$109,900 base salary per year, depending on work location, skills, experience, education, and training.
Company
develops and manufactures data storage solutions, including recording heads and magnetic hard disk drive components.
What you will do
- Design and develop row bar lapping processes and equipment with sub-nanometer dimensional control and angstrom-level surface finishes.
- Perform root-cause analysis, experimentation, process learning, concept validation, and data analysis across multiple process areas.
- Collaborate with internal equipment teams and external suppliers from concept and feasibility through prototype validation, integration, and pre-production readiness.
- Integrate controls, software, vision, automation, inspection, and process-control capabilities into production-ready systems.
- Translate product requirements, KPIVs, and process interactions into equipment, process, and system specifications.
- Prepare validated solutions, engineering documentation, and transfer packages for Thailand-based and other global volume-manufacturing teams.
Requirements
- Bachelor’s degree in Mechanical Engineering with 2+ years of experience, or a Master’s degree with 0+ years of experience.
- Experience supporting high-precision process and equipment design, development, qualification, and manufacturing.
- Ability to work effectively in cross-functional and cross-cultural teams while managing multiple assignments.
- Ability to apply engineering principles, company policies, and procedures to manufacturing process and software-related issues.
- Strong written and verbal communication skills.
Nice to have
- Experience with COMSOL, ANSYS, MATLAB, Python, or JMP for modeling, simulation, statistical analysis, numerical analysis, or process optimization.
- Experience with lapping or polishing in the semiconductor or HDD industry.
- Equipment development or design experience.
Culture & Benefits
- Daily collaboration across mechanical engineering, materials, physics, robotics, electronic sensors, and process-control disciplines.
- Medical, dental, vision, and life insurance, plus short- and long-term disability coverage.
- 401(k), employee stock purchase plan, health savings account, and dependent-care and healthcare spending accounts.
- Paid time off, 12 holidays, paid sick leave, and 16 weeks of paid parental leave.
- On-site café, fitness center, wellness programs, meditation rooms, indoor walking path, and community activities.
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