Hardware Engineer (Optical Transceiver)

Location: Santa Clara, California, United States; hybrid work model with regular on-site work at the assigned Intel site.

Annual salary: $122,440–$232,190 USD.

Company

Develops silicon products and technologies for connected digital devices.

What you will do

• Design optical transceivers and evaluation boards, including schematics, circuit simulations, PCB layout guidance, DFM reviews, and design verification testing.
• Own PCBA development from product requirements and concept through final design, EVT, and DVT.
• Design high-speed 100Gbps and 200Gbps NRZ/PAM4 interfaces, including signal integrity and power integrity analysis.
• Define documentation, BOM specifications, design checklists, and production-readiness requirements with NPI teams.
• Lead design reviews, communicate risks and mitigation plans, and collaborate with mechanical, optical, photonics, firmware, process, and test engineers.
• Troubleshoot and optimize transceiver module performance and coordinate component availability with suppliers and program stakeholders.

Requirements

• Bachelor’s degree with 4+ years of experience, Master’s degree with 3+ years, or PhD in Electrical Engineering or a related STEM field.
• At least 3 years of experience in hardware and circuit design, schematic development, and layout floor planning.
• Experience with Cadence schematic and layout tools and high-density, high-speed multilayer board design.
• Experience selecting and optimizing voltage regulators, microcontrollers, DACs, and ADCs.
• Experience with PCB and product bring-up, laboratory optical and electrical measurements, and high-speed transmission-line design.
• Knowledge of 25–50G NRZ and 100Gbps+ PAM4 signaling.

Nice to have

• Experience with high-volume PCB or substrate fabrication houses and PCB stack-up selection.
• Experience with PI and SI simulations, electronics CAD tools, and modeling.
• Knowledge of optical module architecture, signal integrity, crosstalk, power integrity, noise, ESD, firmware, and testing.
• Experience with SPI, I2C, MDIO, CMIS, AWG, DCAM, VNA, or LCA tools.
• Strong communication and presentation skills.

Culture & Benefits

• Hybrid work model combining on-site and off-site work.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Inclusive employment practices and consideration for qualified applicants regardless of protected characteristics.